-----BEGIN PGP SIGNED MESSAGE----- Hash: SHA1 Am 21.05.2010 23:46, schrieb Stefan Salewski:
> > > > > _______________________________________________ > geda-user mailing list > geda-user@moria.seul.org > http://www.seul.org/cgi-bin/mailman/listinfo/geda-user > Stefan, I fear we go off-topic here, nevertheless I think it's an interesting topic how to solder ICs with an exposed pad with homebrew equipment. Basically there is a contradiction to create a footprint with an exposed pad for reflow soldering and manual soldering. Manual soldering requires a via hole of a decent size that sucks all the solder when doing reflow soldering. > Soldering a few outer pad of the device to fix it is not really > good, because so I can not check if the center thermal pad is really > soldered. This was my very first try before using too much soldr paste --- I had soldered some outer pins and tried to solder the exposed pad from the reverse side (the IC on the bottom side, and IC fell off the board, so my next try was to use too much paste..... And as a hobbyist for me every board is a prototype :-) . - -- Mit freundlichen Gruessen / Best regards Dietmar Schmunkamp -----BEGIN PGP SIGNATURE----- Version: GnuPG v2.0.12 (GNU/Linux) Comment: Using GnuPG with SUSE - http://enigmail.mozdev.org/ iEYEARECAAYFAkv3FdsACgkQn22l+QvEah21fwCfb5OsiD68ih/cKX2Hu8/F5elw g8cAoJfp2uSuKVI3lhGiF5rA15QAq2RN =GZBx -----END PGP SIGNATURE----- _______________________________________________ geda-user mailing list geda-user@moria.seul.org http://www.seul.org/cgi-bin/mailman/listinfo/geda-user