At 05:01 AM 11/25/2010, you wrote:
I am missing the reason you must mirror the footprints, however.
Aren't the pins still in the same orientation they would be with the
standard footprint? Since your DIP packages are mounted in the
"normal-side-up" orientation, it seems the pins should be in the right
order, unless you have placed the IC on the "component" side of the
board in pcb... ?
Yes, the component is at the same position, but traces are on the
opposite side of board so something must be mirrored. SMD traces are
at component layer. Through hole components have traces on solder
layer. Or both of them? Well, you confused me now :-) Maybe I did
not have to mirror the footprints.
regards,
Jan
Yes, of course you have to mirror the ICs that you are changing from
through hole mount to surface mount. As you say they are on the
opposite side of the board from the pads, so now the pads need to be
mirrored, unless the software is capable of moving the pads from one
layer to the other without changing how they look on the screen. But
normally it treats this as moving the part from one side to the other
and you have to mirror the footprint to keep pin one oriented correctly.
Heck, if it wasn't needed to mirror the footprint, it wouldn't work
correctly after you do mirror it.
Rick
_______________________________________________
geda-user mailing list
geda-user@moria.seul.org
http://www.seul.org/cgi-bin/mailman/listinfo/geda-user