> 3. Rename outer layers to top/bottom, which seems to be what other > packages (specifically, eagle and kicad) use. Component/solder > isn't as obvious with SMT.
Sometimes the outer layers are called Primary and Secondary. Consider a board of memory chips. Some memories come in mirror image footprints. One side looks exactly like the other side when you populate both sides with such mirrored chips. Gets even more interesting when the 'Top Side' gets put in an enclosure upside down and production doesn't realize the connector can't be mirrored too. :-( I concede that Top/Bottom is more common, not necessarily accurate. _______________________________________________ geda-user mailing list geda-user@moria.seul.org http://www.seul.org/cgi-bin/mailman/listinfo/geda-user