------------------------<snip>-----------------------
I posted this question on the FLEX-ES list and got back 1 reply, which
included a suggestion to also ask for responses here on IBM-MAIN.
For a bit of background, our applications are all single CSECT load
modules, with the only common exception being those running under CICS,
that are linked with the CICS execution interface stub (which has so far
shown to be upward/downward compatible for decades).
It is therefore easiest for us to supply updates in the form of
replacement load modules, meaning we fix the source code, recompile and
relink before packaging.
What sayeth yee all?
----------------------<unsnip>------------------------
My two cents' worth: if the SMP/E packaging is correct for the type of
fix, it makes little difference. Consider this: if you supply load
modules, they'll have to be in RELFILE format, whereas object decks and
source code can be supplied inline in the fix. Might make a significant
difference in final shipment form. Myself, I would prefer to use object
modules, packaged inline as part of the fix.
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