Yes, a common stackup would be a two-layer rf substrate such as Teflon pressed onto a two-layer fr4 core with an fr4 prepreg in between. Galvanic processing is then done as usual. Best regards Simon
Am 11. September 2017 19:07:19 MESZ schrieb jp charras <jp.char...@wanadoo.fr>: >Le 01/09/2017 à 12:38, Simon Küppers a écrit : >> I was also about to show the optiprint brochure, thanks. I fully >agree with you. We especially like >> to use Teflon materials with thick copper backing, but fr4 plus >ceramic is also quite common here. >> >> > >Hi Simon, > >Do you mean the *same board* has (for instance for a 8 layers board) >the 2 external dielectrics made >in Teflon and the 5 internal dielectrics use fr4 and prepegs? >I am seeing the interest, but this is unclear for me when reading >brochures. > >(The Gerber job file format is currently being finalized, and can be >slightly modified) > > >-- >Jean-Pierre CHARRAS > >_______________________________________________ >Mailing list: https://launchpad.net/~kicad-developers >Post to : kicad-developers@lists.launchpad.net >Unsubscribe : https://launchpad.net/~kicad-developers >More help : https://help.launchpad.net/ListHelp
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