Le 11/09/2017 à 19:12, Simon Küppers a écrit : > Yes, a common stackup would be a two-layer rf substrate such as Teflon > pressed onto a two-layer fr4 > core with an fr4 prepreg in between. Galvanic processing is then done as > usual. > Best regards > Simon > > Am 11. September 2017 19:07:19 MESZ schrieb jp charras > <jp.char...@wanadoo.fr>: > > Le 01/09/2017 à 12:38, Simon Küppers a écrit : > > I was also about to show the optiprint brochure, thanks. I fully > agree with you. We > especially like > to use Teflon materials with thick copper backing, but fr4 plus > ceramic is also quite common > here. > > > > Hi Simon, > > Do you mean the *same board* has (for instance for a 8 layers board) the > 2 external dielectrics made > in Teflon and the 5 internal dielectrics use fr4 and prepegs? > I am seeing the interest, but this is unclear for me when reading > brochures. > > (The Gerber job file format is currently being finalized, and can be > slightly modified) >
Your answer was very useful. The Gerber job file format was just modified to specify more than one substrate material. Do you (or others RF specialists) know (besides the Teflon) other materials used in such boards. Thanks. -- Jean-Pierre CHARRAS _______________________________________________ Mailing list: https://launchpad.net/~kicad-developers Post to : kicad-developers@lists.launchpad.net Unsubscribe : https://launchpad.net/~kicad-developers More help : https://help.launchpad.net/ListHelp
