Actually I didn't notice the hole offset thing in the lower oblong pad. I
just saw that the upper one doesn't have spokes at all. It's unexplainable
when the lower one, identical, does have one spoke (the 45 deg spoke to the
small SMD pad is actually a track). And the upper one doesn't have spokes
on the bottom layer either while there are two spokes there with the old
5.0.2 version.

Eeli Kaikkonen


ke 26. kesäk. 2019 klo 1.08 Jeff Young (j...@rokeby.ie) kirjoitti:

> Great test-case: an offset and rotated pad.
>
> So the old algorithm centred the spokes on the pad; the new one centres
> them on the hole.  I assume old is preferred?
>
> Cheers,
> Jeff.
>
>
> On 25 Jun 2019, at 22:44, Eeli Kaikkonen <eeli.kaikko...@gmail.com> wrote:
>
> There's something wrong in creating the thermal for the oblong pad in the
> attached picture. Left side: 5.0.2. Right: includes your commit. Tested on
> Linux.
>
> Here's also the footprint, taken from the board file:
>
> (module "XX-X-USB:Microusb_female_thrhole_horn" (layer "F.Cu") (tedit
> 5C1B9BE7) (tstamp 5D08B5B8)
>     (at 119.25 105.8 90)
>     (descr "MICRO USB R/A-473460001")
>     (path "/5CDA4205")
>     (attr smd)
>     (fp_text reference "X2" (at 0.15 -6.15 90) (layer "F.SilkS")
>       (effects (font (size 1 1) (thickness 0.15)))
>     )
>     (fp_text value "USB_B_Micro" (at -0.2 4.2 90) (layer "F.SilkS")
>       (effects (font (size 1 1) (thickness 0.15)))
>     )
>     (fp_line (start -3.75 2.75) (end -3.75 -2.75) (layer "F.Fab") (width
> 0.127))
>     (fp_line (start 3.75 2.75) (end -3.75 2.75) (layer "F.Fab") (width
> 0.127))
>     (fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer "F.Fab") (width
> 0.127))
>     (fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer "F.Fab") (width
> 0.127))
>     (fp_circle (center -1.7 -3.8) (end -1.6 -3.8) (layer "F.SilkS") (width
> 0.15))
>     (fp_line (start 4.25 2.65) (end -4.25 2.65) (layer "F.CrtYd") (width
> 0.05))
>     (fp_line (start 4.25 -3.75) (end 4.25 2.65) (layer "F.CrtYd") (width
> 0.05))
>     (fp_line (start -4.25 -3.75) (end 4.25 -3.75) (layer "F.CrtYd") (width
> 0.05))
>     (fp_line (start -4.25 2.65) (end -4.25 -3.75) (layer "F.CrtYd") (width
> 0.05))
>     (fp_line (start 3.9 -2.95) (end 3.65 -2.95) (layer "F.SilkS") (width
> 0.127))
>     (fp_line (start -3.9 -2.95) (end -3.65 -2.95) (layer "F.SilkS") (width
> 0.127))
>     (fp_line (start 3.9 -2.95) (end 3.9 -1.35) (layer "F.SilkS") (width
> 0.127))
>     (fp_line (start -3.9 -2.95) (end -3.9 -1.35) (layer "F.SilkS") (width
> 0.127))
>     (fp_line (start -5.45 1.35) (end 5.5 1.35) (layer "F.Fab") (width
> 0.127))
>     (fp_text user "%V" (at -0.15 4.15 90) (layer "F.Fab")
>       (effects (font (size 1 1) (thickness 0.15)))
>     )
>     (pad "6" thru_hole oval (at -3.575 0 90) (size 1 2) (drill oval 0.6
> 1.2 (offset 0 -0.15)) (layers *.Cu *.Mask "F.Paste")
>       (net 2 "GND") (solder_paste_margin -0.01) (solder_paste_margin_ratio
> -0.0001))
>     (pad "6" thru_hole oval (at 3.575 0 90) (size 1 2) (drill oval 0.6 1.2
> (offset 0 -0.15)) (layers *.Cu *.Mask "F.Paste")
>       (net 2 "GND") (solder_paste_margin -0.01) (solder_paste_margin_ratio
> -0.0001))
>     (pad "6" thru_hole circle (at -2.425 -2.73 90) (size 1 1) (drill 0.6)
> (layers *.Cu *.Mask "F.Paste")
>       (net 2 "GND") (solder_paste_margin -0.01) (solder_paste_margin_ratio
> -0.0001))
>     (pad "6" thru_hole circle (at 2.425 -2.73 90) (size 1 1) (drill 0.6)
> (layers *.Cu *.Mask "F.Paste")
>       (net 2 "GND") (solder_paste_margin -0.01) (solder_paste_margin_ratio
> -0.0001))
>     (pad "1" smd roundrect (at -1.3 -2.66 90) (size 0.4 1.5) (layers
> "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
>       (net 34 "<root sheet>VBUS") (clearance 0.19))
>     (pad "2" smd roundrect (at -0.65 -2.66 90) (size 0.4 1.5) (layers
> "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
>       (net 62 "<root sheet>D-"))
>     (pad "3" smd roundrect (at 0 -2.66 90) (size 0.4 1.5) (layers "F.Cu"
> "F.Paste" "F.Mask") (roundrect_rratio 0.25)
>       (net 63 "<root sheet>D+"))
>     (pad "4" smd roundrect (at 0.65 -2.66 90) (size 0.4 1.5) (layers
> "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
>       (net 59 "<root sheet>id_r"))
>     (pad "5" smd roundrect (at 1.3 -2.66 90) (size 0.4 1.5) (layers "F.Cu"
> "F.Paste" "F.Mask") (roundrect_rratio 0.25)
>       (net 2 "GND") (clearance 0.19))
>     (model
> "${KISYS3DMOD}/Connector_USB.3dshapes/USB_Micro-B_Molex_47346-0001.wrl"
>       (offset (xyz 0 1.2 0))
>       (scale (xyz 1 1 1))
>       (rotate (xyz 0 0 0))
>     )
>   )
>
>
> __________________
> BTW, highlighting items in pcbnew seems to be broken, maybe because of the
> new "real-time highlighting" for delete tool. The delete tool highlight
> doesn't highlight tracks. The older selection clarification and DCR dialog
> item highlighting don't work well, only some things are highlighted
> sometimes. This happens with
>
> Application: Pcbnew
> Version: (5.1.0-1126-g107d206db), release build
> Libraries:
>     wxWidgets 3.0.4
> Platform: Linux 4.15.0-51-generic x86_64, 64 bit, Little endian, wxGTK
> Build Info:
>     wxWidgets: 3.0.4 (wchar_t,wx containers,compatible with 2.8) GTK+ 3.22
>     Boost: 1.65.1
>     OpenCASCADE Community Edition: 6.9.1
>     Compiler: GCC 7.4.0 with C++ ABI 1011
>
> Build settings:
>     KICAD_SCRIPTING=ON
>     KICAD_SCRIPTING_MODULES=ON
>     KICAD_SCRIPTING_PYTHON3=ON
>     KICAD_SCRIPTING_WXPYTHON=ON
>     KICAD_SCRIPTING_WXPYTHON_PHOENIX=ON
>     KICAD_SCRIPTING_ACTION_MENU=ON
>     BUILD_GITHUB_PLUGIN=OFF
>     KICAD_USE_OCE=ON
>     KICAD_USE_OCC=OFF
>     KICAD_SPICE=OFF
>
> __________________
>
> ti 25. kesäk. 2019 klo 23.12 Jeff Young (j...@rokeby.ie) kirjoitti:
>
>> Whoo hooo!
>>
>> An algorithm that doesn’t cut any conceptual corners (and so should be
>> correct), and is fast as well.
>>
>> As always, please send in any exceptions.
>>
>> Cheers,
>> Jeff.
>>
> <Screenshot_left_502_right_g107d206db.png>
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