Hey Tao,
On Thu, Jun 22, 2017 at 11:42:02AM +0800, Tao Wang wrote:
> This patch adds the support for thermal sensor of Hi3660 SoC.
> this will register sensors for thermal framework and use device
> tree to bind cooling device.
>
> Signed-off-by: Tao Wang <kevin.wang...@hisilicon.com>
> Signed-off-by: Leo Yan <leo....@linaro.org>
> ---
> Changes in v2:
> - correct alphabet order
> - correct compatible name
>
> drivers/thermal/Kconfig | 10 ++
> drivers/thermal/Makefile | 1 +
> drivers/thermal/hi3660_thermal.c | 198
> ++++++++++++++++++++++++++++++++++++++
> 3 files changed, 209 insertions(+)
> create mode 100644 drivers/thermal/hi3660_thermal.c
>
> diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig
> index b5b5fac..ed22a90 100644
> --- a/drivers/thermal/Kconfig
> +++ b/drivers/thermal/Kconfig
> @@ -192,6 +192,16 @@ config THERMAL_EMULATION
> because userland can easily disable the thermal policy by simply
> flooding this sysfs node with low temperature values.
>
> +config HI3660_THERMAL
> + tristate "Hi3660 thermal driver"
> + depends on ARCH_HISI || COMPILE_TEST
> + depends on HAS_IOMEM
> + depends on OF
> + default y
> + help
> + Enable this to plug Hi3660 thermal driver into the Linux thermal
> + framework.
> +
> config HISI_THERMAL
> tristate "Hisilicon thermal driver"
> depends on ARCH_HISI || COMPILE_TEST
> diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile
> index 094d703..f29d0a5 100644
> --- a/drivers/thermal/Makefile
> +++ b/drivers/thermal/Makefile
> @@ -55,6 +55,7 @@ obj-$(CONFIG_INTEL_PCH_THERMAL) += intel_pch_thermal.o
> obj-$(CONFIG_ST_THERMAL) += st/
> obj-$(CONFIG_QCOM_TSENS) += qcom/
> obj-$(CONFIG_TEGRA_SOCTHERM) += tegra/
> +obj-$(CONFIG_HI3660_THERMAL) += hi3660_thermal.o
> obj-$(CONFIG_HISI_THERMAL) += hisi_thermal.o
> obj-$(CONFIG_MTK_THERMAL) += mtk_thermal.o
> obj-$(CONFIG_GENERIC_ADC_THERMAL) += thermal-generic-adc.o
> diff --git a/drivers/thermal/hi3660_thermal.c
> b/drivers/thermal/hi3660_thermal.c
> new file mode 100644
> index 0000000..68fa9018
> --- /dev/null
> +++ b/drivers/thermal/hi3660_thermal.c
> @@ -0,0 +1,198 @@
> +/*
> + * linux/drivers/thermal/hi3660_thermal.c
> + *
> + * Copyright (c) 2017 Hisilicon Limited.
> + * Copyright (c) 2017 Linaro Limited.
> + *
> + * Author: Tao Wang <kevin.wang...@hisilicon.com>
> + * Author: Leo Yan <leo....@linaro.org>
> + *
> + * This program is free software; you can redistribute it and/or modify
> + * it under the terms of the GNU General Public License as published by
> + * the Free Software Foundation; version 2 of the License.
> + *
> + * This program is distributed in the hope that it will be useful,
> + * but WITHOUT ANY WARRANTY; without even the implied warranty of
> + * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the
> + * GNU General Public License for more details.
> + *
> + * You should have received a copy of the GNU General Public License
> + * along with this program. If not, see <http://www.gnu.org/licenses/>.
> + */
> +
> +#include <linux/clk.h>
> +#include <linux/device.h>
> +#include <linux/err.h>
> +#include <linux/io.h>
> +#include <linux/kernel.h>
> +#include <linux/of.h>
> +#include <linux/module.h>
> +#include <linux/platform_device.h>
> +#include <linux/thermal.h>
> +
> +#include "thermal_core.h"
> +
> +#define HW_MAX_SENSORS 4
> +#define HISI_MAX_SENSORS 6
> +#define SENSOR_MAX 4
> +#define SENSOR_AVG 5
> +
> +#define ADC_MIN 116
> +#define ADC_MAX 922
> +
> +/* hi3660 Thermal Sensor Dev Structure */
> +struct hi3660_thermal_sensor {
> + struct hi3660_thermal_data *thermal;
> + struct thermal_zone_device *tzd;
> +
> + uint32_t id;
> +};
> +
> +struct hi3660_thermal_data {
> + struct platform_device *pdev;
> + struct hi3660_thermal_sensor sensors[HISI_MAX_SENSORS];
> + void __iomem *thermal_base;
> +};
> +
> +unsigned int sensor_reg_offset[HW_MAX_SENSORS] = { 0x1c, 0x5c, 0x9c, 0xdc };
> +
> +
> +static int hi3660_thermal_get_temp(void *_sensor, int *temp)
> +{
> + struct hi3660_thermal_sensor *sensor = _sensor;
> + struct hi3660_thermal_data *data = sensor->thermal;
> + unsigned int idx;
> + int val, average = 0, max = 0;
> +
> + if (sensor->id < HW_MAX_SENSORS) {
> + val = readl(data->thermal_base + sensor_reg_offset[sensor->id]);
> + val = clamp_val(val, ADC_MIN, ADC_MAX);
> + } else {
> + for (idx = 0; idx < HW_MAX_SENSORS; idx++) {
> + val = readl(data->thermal_base
> + + sensor_reg_offset[idx]);
> + val = clamp_val(val, ADC_MIN, ADC_MAX);
> + average += val;
> + if (val > max)
> + max = val;
> + }
> +
> + if (sensor->id == SENSOR_MAX)
> + val = max;
> + else if (sensor->id == SENSOR_AVG)
> + val = average / HW_MAX_SENSORS;
> + }
> +
> + *temp = ((val - ADC_MIN) * 165000) / (ADC_MAX - ADC_MIN) - 40000;
Where do these constants come from (165000 and 40000) can these some how
be rearranged and described in DT (coefficients) and using the offset and slope
fields?
> +
> + return 0;
> +}
> +
> +static struct thermal_zone_of_device_ops hi3660_of_thermal_ops = {
> + .get_temp = hi3660_thermal_get_temp,
> +};
> +
> +static int hi3660_thermal_register_sensor(struct platform_device *pdev,
> + struct hi3660_thermal_data *data,
> + struct hi3660_thermal_sensor *sensor,
> + int index)
> +{
> + int ret = 0;
> +
> + sensor->id = index;
> + sensor->thermal = data;
> +
> + sensor->tzd = devm_thermal_zone_of_sensor_register(&pdev->dev,
> + sensor->id, sensor, &hi3660_of_thermal_ops);
> + if (IS_ERR(sensor->tzd)) {
> + ret = PTR_ERR(sensor->tzd);
> + sensor->tzd = NULL;
> + }
> +
> + return ret;
> +}
> +
> +static void hi3660_thermal_toggle_sensor(struct hi3660_thermal_sensor
> *sensor,
> + bool on)
> +{
> + struct thermal_zone_device *tzd = sensor->tzd;
> +
> + tzd->ops->set_mode(tzd,
> + on ? THERMAL_DEVICE_ENABLED : THERMAL_DEVICE_DISABLED);
> +}
> +
> +static int hi3660_thermal_probe(struct platform_device *pdev)
> +{
> + struct device *dev = &pdev->dev;
> + struct hi3660_thermal_data *data;
> + struct resource *res;
> + int ret = 0;
> + int i;
> +
> + data = devm_kzalloc(dev, sizeof(*data), GFP_KERNEL);
> + if (!data)
> + return -ENOMEM;
> +
> + data->pdev = pdev;
> + res = platform_get_resource(pdev, IORESOURCE_MEM, 0);
> + data->thermal_base = devm_ioremap_resource(dev, res);
> + if (IS_ERR(data->thermal_base)) {
> + dev_err(dev, "failed get reg base\n");
> + return -ENOMEM;
> + }
> +
> + platform_set_drvdata(pdev, data);
> +
> + for (i = 0; i < HISI_MAX_SENSORS; ++i) {
> + ret = hi3660_thermal_register_sensor(pdev, data,
> + &data->sensors[i], i);
> + if (ret)
> + dev_err(&pdev->dev,
> + "failed to register thermal sensor%d: %d\n",
> + i, ret);
Do you really want to continue if some of the sensors fail to register?
> + else
> + hi3660_thermal_toggle_sensor(&data->sensors[i], true);
> + }
> +
> + dev_info(&pdev->dev, "Thermal Sensor Loaded\n");
Do you really need the above info in the kernel log?
> + return 0;
> +}
> +
> +static int hi3660_thermal_exit(struct platform_device *pdev)
> +{
> + struct hi3660_thermal_data *data = platform_get_drvdata(pdev);
> + int i;
> +
> + for (i = 0; i < HISI_MAX_SENSORS; i++) {
> + struct hi3660_thermal_sensor *sensor = &data->sensors[i];
> +
> + if (!sensor->tzd)
> + continue;
Why are you considering a valid case of not registering all expected
sensors?
> +
> + hi3660_thermal_toggle_sensor(sensor, false);
> + }
> +
> + return 0;
> +}
> +
> +static const struct of_device_id hi3660_thermal_id_table[] = {
> + { .compatible = "hisilicon,hi3660-thermal" },
> + {}
> +};
> +MODULE_DEVICE_TABLE(of, hi3660_thermal_id_table);
> +
> +static struct platform_driver hi3660_thermal_driver = {
> + .probe = hi3660_thermal_probe,
> + .remove = hi3660_thermal_exit,
> + .driver = {
> + .name = "hi3660_thermal",
> + .of_match_table = hi3660_thermal_id_table,
> + },
> +};
> +
> +module_platform_driver(hi3660_thermal_driver);
> +
> +MODULE_AUTHOR("Tao Wang <kevin.wang...@hisilicon.com>");
> +MODULE_AUTHOR("Leo Yan <leo....@linaro.org>");
> +MODULE_DESCRIPTION("hi3660 thermal driver");
> +MODULE_LICENSE("GPL v2");
> --
> 1.7.9.5
>
