This patch adds a book about the Linux Kernel Thermal Framework.
In this change, only a brief introduction is added together with
Makefile changes.
Signed-off-by: Eduardo Valentin <edubez...@gmail.com>
---
Documentation/DocBook/Makefile | 3 +-
Documentation/DocBook/thermal.tmpl | 88 ++++++++++++++++++++++++++++++++++++++
2 files changed, 90 insertions(+), 1 deletion(-)
create mode 100644 Documentation/DocBook/thermal.tmpl
diff --git a/Documentation/DocBook/Makefile b/Documentation/DocBook/Makefile
index 9c7d92d..8163508 100644
--- a/Documentation/DocBook/Makefile
+++ b/Documentation/DocBook/Makefile
@@ -15,7 +15,8 @@ DOCBOOKS := z8530book.xml device-drivers.xml \
80211.xml debugobjects.xml sh.xml regulator.xml \
alsa-driver-api.xml writing-an-alsa-driver.xml \
tracepoint.xml drm.xml media_api.xml w1.xml \
- writing_musb_glue_layer.xml crypto-API.xml
+ writing_musb_glue_layer.xml crypto-API.xml thermal.xml
+ writing_musb_glue_layer.xml
include Documentation/DocBook/media/Makefile
diff --git a/Documentation/DocBook/thermal.tmpl
b/Documentation/DocBook/thermal.tmpl
new file mode 100644
index 0000000..f8fb8a2
--- /dev/null
+++ b/Documentation/DocBook/thermal.tmpl
@@ -0,0 +1,88 @@
+<?xml version="1.0" encoding="UTF-8"?>
+<!DOCTYPE book PUBLIC "-//OASIS//DTD DocBook XML V4.1.2//EN"
+ "http://www.oasis-open.org/docbook/xml/4.1.2/docbookx.dtd"; []>
+
+<book id="thermal-api">
+ <bookinfo>
+ <title>Linux Kernel Thermal Framework API</title>
+
+ <authorgroup>
+ <author>
+ <firstname>Eduardo</firstname>
+ <surname>Valentin</surname>
+ <affiliation>
+ <address>
+ <email>evale...@kernel.org</email>
+ </address>
+ </affiliation>
+ </author>
+ </authorgroup>
+
+ <copyright>
+ <year>2008-2014</year>
+ <holder>Eduardo Valentin</holder>
+ <holder>Sujith Thomas</holder>
+ <holder>Zhang Rui</holder>
+ </copyright>
+ <legalnotice>
+ <para>
+ This documentation is free software; you can redistribute
+ it and/or modify it under the terms of the GNU General Public
+ License version 2 as published by the Free Software Foundation.
+ </para>
+
+ <para>
+ This program is distributed in the hope that it will be
+ useful, but WITHOUT ANY WARRANTY; without even the implied
+ warranty of MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE.
+ See the GNU General Public License for more details.
+ </para>
+
+ <para>
+ For more details see the file COPYING in the source
+ distribution of Linux.
+ </para>
+ </legalnotice>
+ </bookinfo>
+
+<toc></toc>
+
+ <chapter id="introduction">
+ <title>Introduction</title>
+ <para>Thermal management is any method or technique implied to
+ mitigate emergencies caused by operating devices within
+ unsupported temperatures. The challenge consists of designing a
+ product keeping the junction temperature of the IC components.
+ The operating temperature of IC components used on products must
+ operate within their design limits. Besides, temperature towards
+ device enclosure must be in a comfort level for the user.
+ Therefore, thermal management, by the time of this writing,
+ starts in very early device design phase. Managing thermal may
+ involve different disciplines, at different stages, such as
+ temperature monitoring, floorplanning, microarchitectural
+ techniques, compiler techniques, OS techniques, liquid cooling,
+ and thermal reliability or security. This document covers what
+ the Linux Kernel Thermal Framework provides as abstraction to
+ users with respect to thermal management.
+ </para>
+ <para>One of the first proposals to provide a solution to cover
+ the thermal problem appears in the Advanced Configuration and
+ Power Interface (ACPI) specification. ACPI provides an open
+ standard for device configuration and power management by the
+ operating system. However, several computing devices which may
+ have thermal issues in the market disregard the ACPI standard.
+ Therefore, the Linux Kernel Thermal Framework has been designed
+ to serve as abstraction for ACPI and non-ACPI systems. The core
+ concepts applies in both types of systems.
+ </para>
+ <para>The Linux Kernel Thermal Framework has a design which
+ represents the different thermal constraints found in an
+ end-products. The thermal constraints exist to serve different
+ purposes. There two major types of thermal constraints. The
+ first is related to components junction temperature. The second
+ is related to the level of comfort while end users are handling
+ devices.
+ </para>
+
+ </chapter>
+</book>
--
2.1.3
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