On 02/09/15 13:34, Eduardo Valentin wrote:
> + <chapter id="introduction">
> + <title>Introduction</title>
> + <para>Thermal management is any method or technique implied to
> + mitigate emergencies caused by operating devices within
> + unsupported temperatures. The challenge consists of designing a
I would flip the ending of that sentence:
caused by operating devices outside of
supported temperatures.
> + product keeping the junction temperature of the IC components.
> + The operating temperature of IC components used on products must
> + operate within their design limits. Besides, temperature towards
> + device enclosure must be in a comfort level for the user.
> + Therefore, thermal management, by the time of this writing,
> + starts in very early device design phase. Managing thermal may
> + involve different disciplines, at different stages, such as
> + temperature monitoring, floorplanning, microarchitectural
> + techniques, compiler techniques, OS techniques, liquid cooling,
> + and thermal reliability or security. This document covers what
> + the Linux Kernel Thermal Framework provides as abstraction to
> + users with respect to thermal management.
> + </para>
> + <para>One of the first proposals to provide a solution to cover
> + the thermal problem appears in the Advanced Configuration and
> + Power Interface (ACPI) specification. ACPI provides an open
> + standard for device configuration and power management by the
> + operating system. However, several computing devices which may
> + have thermal issues in the market disregard the ACPI standard.
> + Therefore, the Linux Kernel Thermal Framework has been designed
> + to serve as abstraction for ACPI and non-ACPI systems. The core
> + concepts applies in both types of systems.
> + </para>
> + <para>The Linux Kernel Thermal Framework has a design which
> + represents the different thermal constraints found in an
drop: an^^
> + end-products. The thermal constraints exist to serve different
> + purposes. There two major types of thermal constraints. The
There are two
> + first is related to components junction temperature. The second
> + is related to the level of comfort while end users are handling
> + devices.
> + </para>
> +
> + </chapter>
> +</book>
>
--
~Randy
--
To unsubscribe from this list: send the line "unsubscribe linux-kernel" in
the body of a message to [email protected]
More majordomo info at http://vger.kernel.org/majordomo-info.html
Please read the FAQ at http://www.tux.org/lkml/
