Hi Felipe, > -----Original Message----- > From: Felipe Balbi [mailto:ba...@ti.com] > Sent: Thursday, November 19, 2015 8:28 PM > To: Linux USB Mailing List > Cc: Subbaraya Sundeep Bhatta; Ivan T . Ivanov > Subject: Re: [PATCH] usb: dwc3: add generic OF glue layer > > > Hi, > > Felipe Balbi <ba...@ti.com> writes: > > For simple platforms which merely enable some clocks and populate its > > children, we can use this generic glue layer to avoid boilerplate code > > duplication. > > > > For now this supports Qcom and Xilinx, but if we find a way to add > > generic handling of regulators and optional PHYs, we can absorb exynos > > as well. > > > > Signed-off-by: Felipe Balbi <ba...@ti.com> > > --- > > > > Can you guys check if this works for your respective platforms ? If it > > does we can some code duplication going forward. > > gentle ping on this one.
Tested and working fine on Xilinx platform. Thanks, Sundeep > > -- > balbi This email and any attachments are intended for the sole use of the named recipient(s) and contain(s) confidential information that may be proprietary, privileged or copyrighted under applicable law. If you are not the intended recipient, do not read, copy, or forward this email message or any attachments. Delete this email message and any attachments immediately. -- To unsubscribe from this list: send the line "unsubscribe linux-usb" in the body of a message to majord...@vger.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html
