Hi Felipe, > -----Original Message----- > From: Felipe Balbi [mailto:ba...@ti.com] > Sent: Thursday, November 19, 2015 8:28 PM > To: Linux USB Mailing List > Cc: Subbaraya Sundeep Bhatta; Ivan T . Ivanov > Subject: Re: [PATCH] usb: dwc3: add generic OF glue layer > > > Hi, > > Felipe Balbi <ba...@ti.com> writes: > > For simple platforms which merely enable some clocks and populate its > > children, we can use this generic glue layer to avoid boilerplate code > > duplication. > > > > For now this supports Qcom and Xilinx, but if we find a way to add > > generic handling of regulators and optional PHYs, we can absorb exynos > > as well. > > > > Signed-off-by: Felipe Balbi <ba...@ti.com> > > --- > > > > Can you guys check if this works for your respective platforms ? If it > > does we can some code duplication going forward. > > gentle ping on this one.
It is working on Xilinx platform. Thanks, Sundeep > > -- > balbi -- To unsubscribe from this list: send the line "unsubscribe linux-usb" in the body of a message to majord...@vger.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html
