When I wrote that white paper, for work, I was surprised at just how many failure mechanisms were in play. This, on top of any other common electronic failure mechanisms. (Die contamination, metal fatigue, electrophoretic migration, tin whiskers, oxidation, etc.)
-- Jim _______________________________________ http://www.okiebenz.com To search list archives http://www.okiebenz.com/archive/ To Unsubscribe or change delivery options go to: http://mail.okiebenz.com/mailman/listinfo/mercedes_okiebenz.com
