John,
GR-63 allows you to include Root Cause Analysis in the report. If you determine
the cause of the failure, you may find that it is not related to the dust
exposure. Is it possible that ESD caused the failure condition? Your assembly
is handled after each test. Troubleshooting each board in the shelf to find the
failure source will help in your conclusion. Also, what is the product's
design life? How relevant is this test to your product. Include those comments
in the report, if they apply. Keep in mind that if you remove the assembly from
the control of the NRTL, the test conclusion will be that the card/s failed the
test. It never hurts to review the test data to confirm that the test was
performed correctly. You can also retest with a new assembly, for dust only.
If it passes and you have your R.C.A. from the first test, that may be
sufficient.
Gary Raper
"Kretsch, John" <john_kret...@adc.com> on 09/18/2000 11:05:55 AM
Please respond to nebs@world.std.com
To: "'nebs@world.std.com'" <nebs@world.std.com>, "'EMC PSTC'"
<emc-p...@ieee.org>, "'TREG Newsgroup'" <t...@world.std.com>
cc: (bcc: Gary Raper/Raleigh/TEKELEC)
Subject: Hygroscopic Dust Troubleshooting
I thought I would try to contact the collective on this one...
We have a shelf system that is failing GR-63 hygro dust with excessive bit
errors (unit did pass Gaseous contaminants no problem). Air is filtered.
Anyone have experiences that they would like to share (non-proprietary of
course) about how to trouble-shoot and solve this problem? This was the
only GR-63 test to have a failure.
Regards,
John K.
