> In the early 80's I was doing 8 mil lines & spaces, getting two traces > between pads on .1" spacing. It was pushing the limit of the local board > houses. It was also just the ticket for high speed memory boards for a couple > decades, until the DDR stuff came along. Now 6 mil is considered large, 4 mil > is the bottom size without paying for low yields. I still use 8 mil on boards > that can afford it, from a density standpoint.
I do 10/10 if it will fit, a lot of 8/8 and a few 6/6, but most of the stuff I design isn’t terribly tight. > Gold plating has been making a big comeback in recent years -- ENIG -- or > electroless nickel immersion gold. It's a good finish for lead free solder. > Almost everything I've done for 7 or 8 years now gets ENIG. At many board > houses it's not even a premium cost adder. It's a soft finish -- not suitable > for edge connectors. ENIG is much better for high lead count surface mount packages than HASL. It’s also pretty. I did one run of lead free HASL for a group that wanted lead free but didn’t want to spring for ENIG. It worked, but wasn’t as good looking. > PCB design has come a long way. I've been doing it 30 years now. There are > things done on these early PCBs that we avoid like the plague now. Care to share? I’m always up to learn something new. I’ve been amazed at the things that are common knowledge one place and unheard-of at another. - John -- You received this message because you are subscribed to the Google Groups "neonixie-l" group. To unsubscribe from this group and stop receiving emails from it, send an email to neonixie-l+unsubscr...@googlegroups.com. To post to this group, send an email to neonixie-l@googlegroups.com. To view this discussion on the web, visit https://groups.google.com/d/msgid/neonixie-l/98848533-FCFE-40BE-82C6-76FF72E5EA69%40mac.com. For more options, visit https://groups.google.com/d/optout.
