Which package are we using for the 3S4000? I believe it comes in two
types: FG900 and the bigger FG1156.
The mechanical drawings:
http://direct.xilinx.com/bvdocs/packages/fg1156.pdf
http://direct.xilinx.com/bvdocs/packages/fg900.pdf
The device package user guide (
http://direct.xilinx.com/bvdocs/userguides/ug112.pdf ) gives useful data
as to the thermal requirements on pages 42/43 of the pdf. We need to
know how many watts before we can find a cooling solution.
Again, the XP10 comes in two packages: 256 fpBGA
<http://www.latticesemi.com/products/packaging/bga.cfm> and 388 fpBGA.
<http://www.latticesemi.com/products/packaging/bga.cfm>
The package drawings are at
http://www.latticesemi.com/lit/docs/package/pkg.pdf
I can't find thermal data for the lattice FPGA just yet.
Both the FG900 and FG1156 have a max height of 2.6mm and so does the 388
fpBGA. The 356 fpBGA's max height is 2.10mm.
Obviously the chip height will vary from board to board but since they
are quitee similar heights a single heatsink solution may be possible.
--Isaac
_______________________________________________
Open-graphics mailing list
[email protected]
http://lists.duskglow.com/mailman/listinfo/open-graphics
List service provided by Duskglow Consulting, LLC (www.duskglow.com)
