Am 07/08/2011 10:35 PM, schrieb Tomek CEDRO: >> Simply drill the holes and solder both sides - with a thin wire if there >> is no THT pin. This may be a bit painful, but works quite well if you >> take care during layout so that you do not place vias under parts. > Yes, this is the obvious solution for low count VIAs, but I am > wondering on making something more useful to connect both layers on > PAD (that is when also some component use that hole) - this is > especially painful on connectors or other parts that hide top layer > when element is mounted... Note: don't put vias *in* SMD pads - they will wick away the solder when doing automated production. > Still, no solution/idea on how to make pads metalization at home > safely... there is a clear field for a patent, hey inventors wake up! > :-) I have not found a solution that works in a small-volume hobby setting.
cu Michael _______________________________________________ Openocd-development mailing list Openocd-development@lists.berlios.de https://lists.berlios.de/mailman/listinfo/openocd-development
