In all thoroughness, yes 🙂
Juniper Business Use Only ________________________________ From: Joe Clarke (jclarke) <jcla...@cisco.com> Sent: Tuesday, September 26, 2023 2:41 PM To: Richard Roberts <rrobe...@juniper.net>; opsawg@ietf.org <opsawg@ietf.org>; mohamed.boucadair <mohamed.boucad...@orange.com>; Oscar González de Dios <oscar.gonzalezded...@telefonica.com>; samir.barg...@gmail.com <samir.barg...@gmail.com>; Wubo (lana) <lana.w...@huawei.com>; victor.lo...@nokia.com <victor.lo...@nokia.com>; ivan.by...@rbbn.com <ivan.by...@rbbn.com>; Qin Wu <bill...@huawei.com>; ke-oog...@kddi.com <ke-oog...@kddi.com>; luis-angel.mu...@vodafone.com <luis-angel.mu...@vodafone.com> Subject: Re: IPR POLL: Attachment circuits work [External Email. Be cautious of content] Thanks, Richard. To be thorough, I assume you mean all four drafts? Joe Juniper Business Use Only From: Richard Roberts <rrobe...@juniper.net> Date: Tuesday, September 26, 2023 at 05:17 To: Joe Clarke (jclarke) <jcla...@cisco.com>, opsawg@ietf.org <opsawg@ietf.org>, mohamed.boucadair <mohamed.boucad...@orange.com>, Oscar González de Dios <oscar.gonzalezded...@telefonica.com>, samir.barg...@gmail.com <samir.barg...@gmail.com>, Wubo (lana) <lana.w...@huawei.com>, victor.lo...@nokia.com <victor.lo...@nokia.com>, ivan.by...@rbbn.com <ivan.by...@rbbn.com>, Qin Wu <bill...@huawei.com>, ke-oog...@kddi.com <ke-oog...@kddi.com>, luis-angel.mu...@vodafone.com <luis-angel.mu...@vodafone.com> Subject: Re: IPR POLL: Attachment circuits work Hi Joe, No, I'm not aware of any IPR that applies to this draft Juniper Business Use Only ________________________________ From: Joe Clarke (jclarke) <jcla...@cisco.com> Sent: Monday, September 25, 2023 5:28 PM To: opsawg@ietf.org <opsawg@ietf.org>; mohamed.boucadair <mohamed.boucad...@orange.com>; Richard Roberts <rrobe...@juniper.net>; Oscar González de Dios <oscar.gonzalezded...@telefonica.com>; samir.barg...@gmail.com <samir.barg...@gmail.com>; Wubo (lana) <lana.w...@huawei.com>; victor.lo...@nokia.com <victor.lo...@nokia.com>; ivan.by...@rbbn.com <ivan.by...@rbbn.com>; Qin Wu <bill...@huawei.com>; ke-oog...@kddi.com <ke-oog...@kddi.com>; luis-angel.mu...@vodafone.com <luis-angel.mu...@vodafone.com> Subject: IPR POLL: Attachment circuits work [External Email. Be cautious of content] This is a consolidated poll for the following drafts: · draft-boro-opsawg-teas-common-ac · draft-boro-opsawg-teas-attachment-circuit · draft-boro-opsawg-ntw-attachment-circuit · draft-boro-opsawg-ac-lxsm-lxnm-glue Authors and contributors on the To: line, please respond on-list as to whether or not you are aware of any IPR that pertains to this work. Please state either: "No, I'm not aware of any IPR that applies to this draft" or "Yes, I'm aware of IPR that applies to this draft" If you are aware of IPR, indicate whether or not this has been disclosed per IETF IPR rules (see RFCs 3669, 5378, and 8179). Joe
_______________________________________________ OPSAWG mailing list OPSAWG@ietf.org https://www.ietf.org/mailman/listinfo/opsawg
