Hi all. I'm using a Xilink FS48 package which has a 6x8 array of 0.40mm (+/- 0.05mm) solder balls on 0.80mm centers. I can't seem to find any manufacturer's recommendations so I was going to default to a 0.32mm copper defined pad. That's a factor of 0.8. If I went to a 0.300mm pad I could get two 0.10mm traces between pads, but that is a factor of only 0.75 which seems too small. But then I got to thinking about the via sizes and went searching the archives. I didn't really turn anything much up so I thought I'd ask the group what they've found to be a good combination for Pad, Pad mask, Via, Via Mask, Via Hole when using 0.40mm solder balls on a 0.800mm pitch. Also, what are the IPC guidelines since the latest revision for soldermask defined and copper defined?
Jeff Condit ____________________________________________________________ You are subscribed to the PEDA discussion forum To Post messages: mailto:[email protected] Unsubscribe and Other Options: http://techservinc.com/mailman/listinfo/peda_techservinc.com Browse or Search Old Archives (2001-2004): http://www.mail-archive.com/[email protected] Browse or Search Current Archives (2004-Current): http://www.mail-archive.com/[email protected]
