My board assembly shop said that vias in pads would need to be plugged.
I have done it with a HASL board many times before without problems but
most of those were hand assembled, it's easier to add more solder if it
wicks through the board. I've recently started using ENIG for all of my
boards and the holes are much cleaner than they were with HASL. I would
be more worried now than I was before. 

The bottom line for me is that I no longer do via-in-pad. I would in a
pinch but the board fab will be higher.

Regards,
David Kearney

-----Original Message-----
From: [EMAIL PROTECTED] [mailto:[EMAIL PROTECTED]
On Behalf Of Darcy Davis
Sent: Monday, September 26, 2005 2:33 PM
To: PEDA (E-mail)
Subject: [PEDA] Micro Vias

We're heading into new territory for us and so looking into using micro
vias. Currently we're using 10/26mil (drill/annular ring) vias, but
we're still finding that the via's are consuming too much placement
room. My understanding is that with micro vias, we can punch a hole
right through a pad and still be OK through reflow. Does anybody know
otherwise? Since micro vias will be laser drilled (I assume), they can
only go between two adjacent layers, right? Is there typically a
specific size of hole that must be used, or is there just a minimum hole
size requirement? Are there any other limitations to this technology
that I may not have thought of? All else being equal, does anyone know
what the cost differential would be for a board with micro vias vs. our
current 10/26mil vias?


Thanks again,
Darcy Davis
Design Engineer

=========================================================
Dynastream Innovations, Inc.       Ph: (403) 932-9292 ext. 132
228 River Ave.                     Fax: (403) 932-6521    
Cochrane, AB  T4C 2C1              Web: www.dynastream.com
Canada
=========================================================


 
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