We're heading into new territory for us and so looking into using micro vias. Currently we're using 10/26mil (drill/annular ring) vias, but we're still finding that the via's are consuming too much placement room. My understanding is that with micro vias, we can punch a hole right through a pad and still be OK through reflow. Does anybody know otherwise? Since micro vias will be laser drilled (I assume), they can only go between two adjacent layers, right? Is there typically a specific size of hole that must be used, or is there just a minimum hole size requirement? Are there any other limitations to this technology that I may not have thought of? All else being equal, does anyone know what the cost differential would be for a board with micro vias vs. our current 10/26mil vias?
Thanks again, Darcy Davis Design Engineer ========================================================= Dynastream Innovations, Inc. Ph: (403) 932-9292 ext. 132 228 River Ave. Fax: (403) 932-6521 Cochrane, AB T4C 2C1 Web: www.dynastream.com Canada ========================================================= ____________________________________________________________ You are subscribed to the PEDA discussion forum To Post messages: mailto:[email protected] Unsubscribe and Other Options: http://techservinc.com/mailman/listinfo/peda_techservinc.com Browse or Search Old Archives (2001-2004): http://www.mail-archive.com/[email protected] Browse or Search Current Archives (2004-Current): http://www.mail-archive.com/[email protected]
