Brad, Thank you for clarifying. Always interesting to learn what others are experiencing. We aren't using no-clean paste. I imagine that's the biggest process difference between us.
Live and learn. Thanks again, Steve At 11:02 AM 1/12/2006, you wrote: >Steve, > My pads are similarly oriented. Typically my pad width > matches the chip width. > > We are homeplating because of excess solderball generation. > It is something that became more prevalent recently with current > formulations of no-clean (leaded) solder pastes that we were > getting. Our screens are anywhere from 5mil to 7 mil thickness > depending on the assemblies. We are homeplating all chip components > that do not have some form of relief (i.e. SMB or SMC devices, some > molded devices have relief areas, troughs, around the contact where > the solderpaste is not squished between the contact and the part > body) around the pads/contacts. Our SMT people tried a lot of other > solutions and consulted with the paste supplier extensively, the > only workable solution we found was the homeplating. Of course > being a SMT production issue it could have contributing factors > from many sources during processing. > >Sincerely, >Brad Velander >Senior PCB Designer >Northern Airborne Technology >#14 - 1925 Kirschner Road, >Kelowna, BC, V1Y 4N7. >tel (250) 763-2329 ext. 225 >fax (250) 762-3374 > ____________________________________________________________ You are subscribed to the PEDA discussion forum To Post messages: mailto:[email protected] Unsubscribe and Other Options: http://techservinc.com/mailman/listinfo/peda_techservinc.com Browse or Search Old Archives (2001-2004): http://www.mail-archive.com/[email protected] Browse or Search Current Archives (2004-Current): http://www.mail-archive.com/[email protected]
