On 2006-07-28 13:32:24, you wrote: > If you are trying to get that last little bit of extra thermal cooling, if > your PCB has multiple layers, flood fill the layers under the component with > coper. Also, if you can add a grid of pads around the component which may > be waved/filled with soldier, this can also help.
Couldn't it be that open holes (not filled with solder) are effective, too -- in horizontal PCBs? They'd possibly create some additional convection. Gerhard ____________________________________________________________ You are subscribed to the PEDA discussion forum To Post messages: mailto:[email protected] Unsubscribe and Other Options: http://techservinc.com/mailman/listinfo/peda_techservinc.com Browse or Search Old Archives (2001-2004): http://www.mail-archive.com/[email protected] Browse or Search Current Archives (2004-Current): http://www.mail-archive.com/[email protected]
