--- Dennis Saputelli <[EMAIL PROTECTED]> wrote:

> 
> i assume you meant '99SE' ?
> 
Yes I did mean that as matter of fact.

> the autorouter for it's time (which was not new even at that time)
> actually wasn't too bad, but it certainly was not made to do BGAs
> it did do a decent job at lined up rows of random wired DIPS  :)
> 
Well I have wired lots of dips with it, but it had quite a few anoying
bugs in it still.  In any case I'm looking at surface mount devices
instead.  So how does one do a BGA since it's only contact technically
is the top or bottom layer.  Does one employ vias near the pads or
something?

> i wouldn't get my hopes up about autorouting that thing
> 
A 144 pin LFBGA is too much for it? 

> to do a solder mask opening smaller than the pad use a negative
> expansion
> 
That is definately helpful.

> my brain is wired in mils so...
> for a 40 mil pad with a 30 mil opening use
> solder mask expansion of -5 mils
> 
I'm so use to converting between the two I almost do it in my head
these days. So that would be the override designation for the
soldermask? (is this defined on the part or in the Design Rules... 99SE
is a bit of a maze it looks like someone kept adding features to
something that started small).

> what is driving the 'solder mask defined' ?
> i have read both pros and cons about that but everyone i know does
> not do it
> 
You mean solder mask over pad instead of mask about pad? It was
mentioned in the package JTAG information so I asked.

> .125mm is 4.9 mils
> 5 mil trace/space is almost ordinary these days
> 
> for BGAs depending on the pitch we sometimes need to go to 4mil trace
> 
> 4mil space AKA 4/4
> 
Right FBGA is 0.8 mm which is 31.4 mils.  So it's not a big deal to
have such small traces anymore then?

Stephen

Stephen R. Phillips was here
Please be advised what was said may be absolutely wrong, and hereby this 
disclaimer follows.  I reserve the right to be wrong and admit it in front of 
the entire world.

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