Re: K6 and Debian (and heatsinks)

1997-11-29 Thread liiwi
  
  Most CPU fans I've seen come with a pad of conductive [something] which
  goes between the processor and the heatsink.  I would think that something
  like this would be essential, given that the surfaces are probably not
  perfectly flat (on a nano scale).
 I think it's more a case of sheer laziness. The thermal grease doesn't
 come with the heatsink/fan combo, so has to be purchased seperately, and
 applied.

 It's not laziness, it's more like criminal negligence (my limited english 
shows here, 
 but you'll get the idea). If a shop that build the machine says it doesn't 
matter, then
 I question their professionality. 

 At work, if we happen to see a tube of thermal grease, we'll apply some,
 but we don't break our necks looking for it or anything.

 You can get a tube of it from almost any shop that sells electronic components
 (chips etc.) - at least here in Finland. It costs about 45 FIM = about 9 USD 
and
 lasts for about 40 machines. 

 If you want to try - put your finger on a bare processor ( 486DX33) and power
 on the machine with some load on the cpu and see how long you can keep it 
there ;-)

 Note: some Cyrix etc. chips stay almost cool until they start to do something. 

 Within a month I've seen 4 fried processors. Two of them were because faulty 
 regulators on the motherboard and two were normally clocked *without* anything
 between the processor and heatsink. Heatsinks were good. 

 A fried cpu is not always just dead. I've seen one that made funny things with
 interrupts, and that was hard to diagnose. 

--j 'liquid hydrogen for the processor' ;-)







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Re: K6 and Debian (and heatsinks)

1997-11-29 Thread Rick Hawkins

frank wrote,
 Rick Hawkins [EMAIL PROTECTED] wrote

  They work wonderfully.  I have a k6-166 running at 210/83
  quite happilly. However, it needs some cooling at this
  speed; until i get something more than this cheesy $2 fan,
  I need to keep the side off to compile (but not at
  166/66).

  How is the heatsink (between the fan and the CPU,
 right?) attached to the CPU?  Are you using heatsink
 compound (thermal compound, heatsink grease) between
 the heatsink and the CPU?

I used a $2 tube of heat sink compound from radio shack.  And, for the moment, 
an audio cassette tape to prob up the fan, as it slides down (board is upright 
in the tower).

I just added a second case fan, blowing down from the top half of the case, 
and this with a cheesy fan now seems to be enough--I closed the case, and it's 
done a couple of kernel compiles so far.  It seems that the front case fan 
isn't doing much--it doesn't seem to blow much air at all, but then it's 
partway blocked from it's mounting hardware, and really doesn't have a good 
source to draw from.  Maybe I'll move it to the top  of the case to blow more 
air in.

Hmm, now that I'm stable at 210/83, maybe I should play with voltage and go 
for 250 :)


  Does anyone have any experience with this?  In
 the old days, voltage regulators and power transistors
 and such hot-running ICs usually were not just attached
 to their heatsinks bare, but were smeared with
 heatsink/thermal compound first in order to provide better
 heat transfer than a bare connection would provide.

yes, do this.  It was the difference between running stably and not.

 
  However, I have gathered that the typical CPU
 heatsink is just put on bare.  Is this just laziness
 on the part of assemblers or is there some legitimate
 reason to think the heatsink compound is not needed
 with CPUs?

Laziness. It should really be there.  It makes a better thermal connection.

rick



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Re: K6 and Debian (and heatsinks)

1997-11-29 Thread Jason Gunthorpe

On Fri, 28 Nov 1997 [EMAIL PROTECTED] wrote:

  A fried cpu is not always just dead. I've seen one that made funny things 
 with
  interrupts, and that was hard to diagnose. 

This is why I always put heatsink goop on the chip, without it the
heatsink/fan doesn't do much. The problems you can get from an overheating
processor are varied and can be quite subtle. I'd rather not have some odd
problem because someone decided 0.10$ worth of thermal compound was too
much trouble.

Basically, if the tempurature of your chip is higher than the tempurature
of the heat sink you are in trouble. I've seen heat sinks with what
appears to be ductape on the bottom (It isn't though) and that doesn't
seem to do much of anything.

Be sure to realize that some Pentium chips dissapate ~20 watts of power,
that's ALOT of heat, the chip can go from room tempurature to untouchably
hot in about 20 seconds! If you have a Cyrix chip then be sure to use
set6x86 to enable the power saving mode, it will keep the chip cooler than
a Pentium if your machine is mostly idle.

Jason


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Re: K6 and Debian (and heatsinks)

1997-11-28 Thread Dale Harrison
 
 Most CPU fans I've seen come with a pad of conductive [something] which
 goes between the processor and the heatsink.  I would think that something
 like this would be essential, given that the surfaces are probably not
 perfectly flat (on a nano scale).

I think it's more a case of sheer laziness. The thermal grease doesn't
come with the heatsink/fan combo, so has to be purchased seperately, and
applied.

At work, if we happen to see a tube of thermal grease, we'll apply some,
but we don't break our necks looking for it or anything.

D.


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Re: K6 and Debian (and heatsinks)

1997-11-28 Thread Nathan E Norman
On Thu, 27 Nov 1997, Frank Sergeant wrote:

[ snip ]
: 
:  Does anyone have any experience with this?  In
: the old days, voltage regulators and power transistors
: and such hot-running ICs usually were not just attached
: to their heatsinks bare, but were smeared with
: heatsink/thermal compound first in order to provide better
: heat transfer than a bare connection would provide.

A 300W RF amp built without using thermal compound will fail in a hurry
(and smell bad, too :)

: 
:  However, I have gathered that the typical CPU
: heatsink is just put on bare.  Is this just laziness
: on the part of assemblers or is there some legitimate
: reason to think the heatsink compound is not needed
: with CPUs?

Other than cost, no good reason whatsoever.  Most techs I've been around
have no idea that thermal compound exists, but I don't consider
ignorance a legitimate excuse in this case.

Personally, I've got a tube of compound at my desk; any PC I end up
fiddling with gets its heatsink checked.

--
Nathan Norman
MidcoNet - 410 South Phillips Avenue - Sioux Falls, SD  57104
phone: (605) 334-4454 fax: (605) 335-1173
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Re: K6 and Debian (and heatsinks)

1997-11-27 Thread Frank Sergeant
Rick Hawkins [EMAIL PROTECTED] wrote

 They work wonderfully.  I have a k6-166 running at 210/83
 quite happilly. However, it needs some cooling at this
 speed; until i get something more than this cheesy $2 fan,
 I need to keep the side off to compile (but not at
 166/66).

 How is the heatsink (between the fan and the CPU,
right?) attached to the CPU?  Are you using heatsink
compound (thermal compound, heatsink grease) between
the heatsink and the CPU?

 Does anyone have any experience with this?  In
the old days, voltage regulators and power transistors
and such hot-running ICs usually were not just attached
to their heatsinks bare, but were smeared with
heatsink/thermal compound first in order to provide better
heat transfer than a bare connection would provide.

 However, I have gathered that the typical CPU
heatsink is just put on bare.  Is this just laziness
on the part of assemblers or is there some legitimate
reason to think the heatsink compound is not needed
with CPUs?


  -- Frank
  [EMAIL PROTECTED]


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Re: K6 and Debian (and heatsinks)

1997-11-27 Thread Tommy Lakofski
Most CPU fans I've seen come with a pad of conductive [something] which
goes between the processor and the heatsink.  I would think that something
like this would be essential, given that the surfaces are probably not
perfectly flat (on a nano scale).

On Thu, 27 Nov 1997, Frank Sergeant wrote:
  Does anyone have any experience with this?  In
 the old days, voltage regulators and power transistors
 and such hot-running ICs usually were not just attached
 to their heatsinks bare, but were smeared with
 heatsink/thermal compound first in order to provide better
 heat transfer than a bare connection would provide.
 
  However, I have gathered that the typical CPU
 heatsink is just put on bare.  Is this just laziness
 on the part of assemblers or is there some legitimate
 reason to think the heatsink compound is not needed
 with CPUs?


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