[Elecraft] OT: News Article on "Tin Whiskers" Ruining Electronics

2007-10-18 Thread Dick & Judy Lamb
A recent Associated Press article discusses a topic that's received much 
attention on this reflector:   the negative consequences of 
environmental restrictions on lead in solder for electronics.  The 
primary concern the article mentions is that tin, when in an alloy 
absent of lead, promotes the spontaneous  growth of tiny  "tin whiskers" 
that can short traces in circuit boards.  Failures stemming from 
whiskers are cited in electronics ranging from consumer items to 
satellites. The article as it appeared in my local newspaper had a very 
dramatic photo of whiskers on a tin-plated tuning capacitor. 


http://www.theworldlink.com/articles/2007/10/06/news/doc4707c03901b23958789121.txt

I should note, for newcomers to the reflector, that Elecraft's list of 
approved solders specifically cautions against using any that are lead 
free:


http://www.elecraft.com/TechNotes/N0SS_SolderNotes/Elecraft-Recommended%20Solders%2009JAN2007.pdf 




Dick, K0KK
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Re: [Elecraft] OT: News Article on "Tin Whiskers" Ruining Electronics

2007-10-18 Thread Don Wilhelm
Typical of news reports, the media seems to concentrate on the 
sensational.  Certainly, the proliferation of throw-away consumer 
electronics ending up in landfills is a grave concern for adding to the 
lead content of our environment, and I applaud the efforts to keep that 
to a minimum.


But, consider just how many ham rigs end up in landfills - not many in 
my opinion.  We have many avid collectors of old ham gear and in many 
cases, boat anchors are a prized possession.  Lead-free solders are a 
real salvation for manufacturers (BTW, the K3 and later K2 boards are 
RoHS compliant) who can implement the lead-free techniques.  For 
personal soldering, I chose to use my 63/37 alloy solder, and I know 
that little of it will ever find its way to the landfill.


The 'tin-whiskers' problem is one that exists mainly at the chip level.  
The migration of conductive paths between pins that can be soldered by 
hand techniques is *not* a problem because the 'whiskers' typically do 
not extend that far.  It is a problem inside the chips where distances 
are measured in angstroms rather than in fractional inches or millimeters.


Bottom line - while you may eventually see this 'tin whiskers' problem 
resulting in IC failures, it will not be apparent in the soldering that 
we hams do, even with the fine pitch SMD devices.


73,
Don W3FPR

Dick & Judy Lamb wrote:
A recent Associated Press article discusses a topic that's received 
much attention on this reflector:   the negative consequences of 
environmental restrictions on lead in solder for electronics.  The 
primary concern the article mentions is that tin, when in an alloy 
absent of lead, promotes the spontaneous  growth of tiny  "tin 
whiskers" that can short traces in circuit boards.  Failures stemming 
from whiskers are cited in electronics ranging from consumer items to 
satellites. The article as it appeared in my local newspaper had a 
very dramatic photo of whiskers on a tin-plated tuning capacitor.
http://www.theworldlink.com/articles/2007/10/06/news/doc4707c03901b23958789121.txt 



I should note, for newcomers to the reflector, that Elecraft's list of 
approved solders specifically cautions against using any that are lead 
free:



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Re: [Elecraft] OT: News Article on "Tin Whiskers" Ruining Electronics

2007-10-19 Thread N2EY
In a message dated 10/19/07 12:28:43 AM Eastern Daylight Time, 
[EMAIL PROTECTED] writes:


> But, consider just how many ham rigs end up in landfills - not many in 
> my opinion. 

Agreed - for two reasons.

One is that there simply aren't that many ham rigs around, compared to other 
electronic devices such as TVs or computers.

But the big reason is that we hams try to get as much use out of a piece of 
equipment as possible, rather than just tossing it in the trash when something 
newer comes along, or it develops a problem. Even a rig that is judged "not 
worth fixing" becomes a parts source to keep others going.

The computer this was written on is a Dell Dimension XPS R400. It was 
intercepted on its way to the dumpster a year or so ago. It cost more than a 
K3-100 
when it was new (about 1999?) yet it was considered to be worthless trash in 
less than a decade. A little work and it does the job. 

Maybe there's a message there we hams need to spread.

73 de Jim, N2EY


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Re: [Elecraft] OT: News Article on "Tin Whiskers" Ruining Electronics

2007-10-19 Thread Mike S

At 12:28 AM 10/19/2007, Don Wilhelm wrote...
The 'tin-whiskers' problem is one that exists mainly at the chip 
level.
The migration of conductive paths between pins that can be soldered by 
hand techniques is *not* a problem because the 'whiskers' typically do 
not extend that far.  It is a problem inside the chips where distances 
are measured in angstroms rather than in fractional inches or 
millimeters.


Not according to NASA studies. They state "Whiskers as long as a few 
millimeters are not uncommon..." - 
http://nepp.nasa.gov/whisker/background/index.htm


Common through hole IC packages (DIP) have 2.54mm center to center, 
which means ~1 mm air gap between pins, and that is also a _very_ 
common hole spacing pattern for discrete components. Here's an example 
of non-"chip level" failure caused by tin whiskers: 
http://nepp.nasa.gov/whisker/photos/pom/2004april.htm



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Re: [Elecraft] OT: News Article on "Tin Whiskers" Ruining Electronics

2007-10-19 Thread Don Wilhelm

Mike and Jack,

My apologies for posting based on my lack of knowledge.

Thanks for the educational updates.  I certainly am not prone to argue 
with the NASA research folks.
I do recall that it was a big concern inside ICs back in the 1980s and 
90s when I was closely associated with the industry and more and more 
density was being crammed inside those multi-legged critters.


I am surprised at the magnitude of inconsistencies and uncertainties 
still present in the research data.
It is very interesting to find that dipping with tin-lead solder appears 
to inhibit the growth, so those of us using tin-lead solders are 
actually helping a bit to inhibit the growth - but then we don't re-tin 
the full length of all the leads on all components either, so there is 
remaining exposure.


So based on reading those articles - my conclusion is that we should 
continue using the tin-lead solder and discourage the use of lead-free 
solder for as long as we are able to do that.  Since the tin-whisker 
induced failures seem to take about a year or more to develop, I might 
consider extended warranty coverage for any expensive electronic devices 
as more and more of them move to RoHS compliance.  This is really a 
two-edged sword.


73,
Don W3FPR

Mike S wrote:

At 12:28 AM 10/19/2007, Don Wilhelm wrote...

The 'tin-whiskers' problem is one that exists mainly at the chip level.
The migration of conductive paths between pins that can be soldered 
by hand techniques is *not* a problem because the 'whiskers' 
typically do not extend that far.  It is a problem inside the chips 
where distances are measured in angstroms rather than in fractional 
inches or millimeters.


Not according to NASA studies. They state "Whiskers as long as a few 
millimeters are not uncommon..." - 
http://nepp.nasa.gov/whisker/background/index.htm


Common through hole IC packages (DIP) have 2.54mm center to center, 
which means ~1 mm air gap between pins, and that is also a _very_ 
common hole spacing pattern for discrete components. Here's an example 
of non-"chip level" failure caused by tin whiskers: 
http://nepp.nasa.gov/whisker/photos/pom/2004april.htm






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Re: [Elecraft] OT: News Article on "Tin Whiskers" Ruining Electronics

2007-10-19 Thread Matt Palmer
main problem with the article is both space programs and military are
exempt from being ROHS compliant, so why would lead free solder be in
a satellite?


Matt
KD8DAO
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Re: [Elecraft] OT: News Article on "Tin Whiskers" Ruining Electronics

2007-10-19 Thread Don Wilhelm
It is not all in the solder, the problem even for RoHS exemptions is the 
tin plating on the components.

73, Don W3FPR

Matt Palmer wrote:

main problem with the article is both space programs and military are
exempt from being ROHS compliant, so why would lead free solder be in
a satellite?

  

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Re: Re: [Elecraft] OT: News Article on "Tin Whiskers" Ruining Electronics

2007-10-20 Thread d.cutter
The problem with ROHS compliant soldering is that you must not be able to mix 
it up with leaded solder.  So, a manufacturer has to have one or the other, or 
separate lines running one each exclusively.  So, if the manufacturer wants 
volume production capability it has to move over to lead-free and dispense with 
leaded all together in a practical set-up.

BTW, I don't think there are any cases of death by poisoning from leaded 
solder: it's now only a case of environmental issues (ie politics).

David
G3UNA
> 
> From: "Matt Palmer" <[EMAIL PROTECTED]>
> Date: 2007/10/19 Fri PM 04:27:15 BST
> To: elecraft@mailman.qth.net
> Subject: Re: [Elecraft] OT: News Article on "Tin Whiskers" Ruining Electronics
> 
> main problem with the article is both space programs and military are
> exempt from being ROHS compliant, so why would lead free solder be in
> a satellite?
> 
> 
> Matt
> KD8DAO
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