Re: [PSES] LISN Bonding to Ground Plane for CEMI Testing per ANSI C63.4

2015-03-13 Thread John Woodgate
In message 
OF24201270.2EDF97A3-ON85257E06.007BDBCE-85257E06.007D2D07@bureauveritas.
com, dated Thu, 12 Mar 2015, Chris Bramley 
christopher.bram...@us.bureauveritas.com writes:


ANSI C63.4-2014 clause 5.2.2 requires a direct current resistance of 
less than or equal to 2.5 milliohms between the LISN being used for 
CEMI measurements and the reference ground plane.


It doesn't seem to me to be a very sensible requirement. For example, it 
matters where on the LISN and where on the ground plane the resistance 
is measured. Neither object is a superconductor!


Is there a similarly stringent requirement for the resistance of the 
ground plane between the LISN and the EUT? It seems to me that if that 
is much higher than 2.5 mohms, the 2.5 mohms is not very important.

--
OOO - Own Opinions Only. With best wishes. See www.jmwa.demon.co.uk
When I turn my back on the sun, it's to look for a rainbow
John Woodgate, J M Woodgate and Associates, Rayleigh, Essex UK

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Re: [PSES] LISN Bonding to Ground Plane for CEMI Testing per ANSI C63.4

2015-03-13 Thread Charlie Blackham
A suitable 4-port bonding meter is the VICI VC480C+ 3 1/2 Digital Resistance 
Tester - available on-line for about $100.

Regards
Charlie

From: Ken Javor [mailto:ken.ja...@emccompliance.com]
Sent: 13 March 2015 02:58
To: EMC-PSTC@LISTSERV.IEEE.ORG
Subject: Re: [PSES] LISN Bonding to Ground Plane for CEMI Testing per ANSI C63.4

All that is necessary is a clean metal-to-metal faying surface bond.  There are 
any number of bond meters out there. Some of the old ones are the HP4328A 
(which has a modern digital incarnation) and the Keithley Model 580 (which is 
also obsolete but has a modern replacement that likely someone else on this 
forum can cite).

Ken Javor
Phone: (256) 650-5261


From: Chris Bramley 
christopher.bram...@us.bureauveritas.commailto:christopher.bram...@us.bureauveritas.com
Reply-To: 
christopher.bram...@us.bureauveritas.commailto:christopher.bram...@us.bureauveritas.com
Date: Thu, 12 Mar 2015 18:47:15 -0400
To: EMC-PSTC@LISTSERV.IEEE.ORGmailto:EMC-PSTC@LISTSERV.IEEE.ORG
Subject: [PSES] LISN Bonding to Ground Plane for CEMI Testing per ANSI C63.4

ANSI C63.4-2014 clause 5.2.2 requires a direct current resistance of less than 
or equal to 2.5 milliohms between the LISN being used for CEMI measurements and 
the reference ground plane. Is it possible to achieve this low level of 
resistance by simply bolting the LISN to the ground plane(after thoroughly 
cleaning the LISN and ground plane contact points)? I am looking for a solution 
that allows the LISNs to remain reasonably portable as they are regularly 
transferred between test sites. Also, what combination of Kelvin probes and 
milliohm meter works best to take quick, repeatable measurements of the 
resistance between the LISN and the ground plane?

Christopher Bramley
EMC Test Engineer I
Bureau Veritas - Consumer Products Services
Littleton Distribution Center
1 Distribution Center Circle, Suite 1
Littleton, MA 01460, USA
978.486.8880 x6135
christopher.bram...@us.bureauveritas.commailto:christopher.bram...@us.bureauveritas.com

This message contains confidential information.
To know more, please click on the following link: 
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Re: [PSES] LISN Bonding to Ground Plane for CEMI Testing per ANSI C63.4

2015-03-13 Thread Ken Javor
A ground plane made of copper, brass or aluminum of any extent (width as
well as length) will have microohms of resistance and the bonding
requirement of 2.5 milliohms is reasonable. It typically requires a
metal-to-metal faying surface bond (or wide bond strap) commensurate with
low inductance, which is the real technical requirement enforced by the
simple dc requirement.

Ken Javor
Phone: (256) 650-5261


 From: John Woodgate j...@jmwa.demon.co.uk
 Reply-To: John Woodgate j...@jmwa.demon.co.uk
 Date: Fri, 13 Mar 2015 06:20:37 +
 To: EMC-PSTC@LISTSERV.IEEE.ORG
 Subject: Re: [PSES] LISN Bonding to Ground Plane for CEMI Testing per ANSI
 C63.4
 
 In message 
 OF24201270.2EDF97A3-ON85257E06.007BDBCE-85257E06.007D2D07@bureauveritas.
 com, dated Thu, 12 Mar 2015, Chris Bramley
 christopher.bram...@us.bureauveritas.com writes:
 
 ANSI C63.4-2014 clause 5.2.2 requires a direct current resistance of
 less than or equal to 2.5 milliohms between the LISN being used for
 CEMI measurements and the reference ground plane.
 
 It doesn't seem to me to be a very sensible requirement. For example, it
 matters where on the LISN and where on the ground plane the resistance
 is measured. Neither object is a superconductor!
 
 Is there a similarly stringent requirement for the resistance of the
 ground plane between the LISN and the EUT? It seems to me that if that
 is much higher than 2.5 mohms, the 2.5 mohms is not very important.
 -- 
 OOO - Own Opinions Only. With best wishes. See www.jmwa.demon.co.uk
 When I turn my back on the sun, it's to look for a rainbow
 John Woodgate, J M Woodgate and Associates, Rayleigh, Essex UK
 
 -
 
 This message is from the IEEE Product Safety Engineering Society emc-pstc
 discussion list. To post a message to the list, send your e-mail to
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Re: [PSES] LISN Bonding to Ground Plane for CEMI Testing per ANSI C63.4

2015-03-13 Thread Kunde, Brian
Has anyone experimented with the bonding of their LISN and have data to show 
the difference between different bonding methods?

1. bolted directly to the ground plane
2. isolated from the ground plane but bonded with a
-   copper strap (of different widths)
-   copper tinned braid (of different widths)
-   insulated hookup wire (of different gages)

Sounds like a fun experiment. I might give it a try if I can find the time.

The Other Brian

-Original Message-
From: Ken Javor [mailto:ken.ja...@emccompliance.com]
Sent: Friday, March 13, 2015 10:31 AM
To: EMC-PSTC@LISTSERV.IEEE.ORG
Subject: Re: [PSES] LISN Bonding to Ground Plane for CEMI Testing per ANSI C63.4

A ground plane made of copper, brass or aluminum of any extent (width as well 
as length) will have microohms of resistance and the bonding requirement of 2.5 
milliohms is reasonable. It typically requires a metal-to-metal faying surface 
bond (or wide bond strap) commensurate with low inductance, which is the real 
technical requirement enforced by the simple dc requirement.

Ken Javor
Phone: (256) 650-5261


 From: John Woodgate j...@jmwa.demon.co.uk
 Reply-To: John Woodgate j...@jmwa.demon.co.uk
 Date: Fri, 13 Mar 2015 06:20:37 +
 To: EMC-PSTC@LISTSERV.IEEE.ORG
 Subject: Re: [PSES] LISN Bonding to Ground Plane for CEMI Testing per
 ANSI
 C63.4

 In message
 OF24201270.2EDF97A3-ON85257E06.007BDBCE-85257E06.007D2D07@bureauveritas.
 com, dated Thu, 12 Mar 2015, Chris Bramley
 christopher.bram...@us.bureauveritas.com writes:

 ANSI C63.4-2014 clause 5.2.2 requires a direct current resistance of
 less than or equal to 2.5 milliohms between the LISN being used for
 CEMI measurements and the reference ground plane.

 It doesn't seem to me to be a very sensible requirement. For example,
 it matters where on the LISN and where on the ground plane the
 resistance is measured. Neither object is a superconductor!

 Is there a similarly stringent requirement for the resistance of the
 ground plane between the LISN and the EUT? It seems to me that if that
 is much higher than 2.5 mohms, the 2.5 mohms is not very important.
 --
 OOO - Own Opinions Only. With best wishes. See www.jmwa.demon.co.uk
 When I turn my back on the sun, it's to look for a rainbow John
 Woodgate, J M Woodgate and Associates, Rayleigh, Essex UK

 -
 
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Re: [PSES] LISN Bonding to Ground Plane for CEMI Testing per ANSI C63.4

2015-03-13 Thread John Woodgate
In message d1285ee5.69ff8%ken.ja...@emccompliance.com, dated Fri, 13 
Mar 2015, Ken Javor ken.ja...@emccompliance.com writes:


A ground plane made of copper, brass or aluminum of any extent (width 
as well as length) will have microohms of resistance


I wonder if that's always true when you take into account the contact 
between the EUT and the ground plane, not just the ground plane itself.

--
OOO - Own Opinions Only. With best wishes. See www.jmwa.demon.co.uk
When I turn my back on the sun, it's to look for a rainbow
John Woodgate, J M Woodgate and Associates, Rayleigh, Essex UK

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Re: [PSES] LISN Bonding to Ground Plane for CEMI Testing per ANSI C63.4

2015-03-13 Thread Ed Price
Chris:

 

I most recently used Solar LISN’s; these models had an approximately 1/8”
thick aluminum baseplate that extended beyond the front and rear edges. I
could get completely adequate bonding resistance by just using a clamp to
hold the aluminum flange snugly to the copper ground plane. I would just use
a Scotch-Brite pad to shine up the copper and aluminum faces prior to
attaching the clamps. I would verify my bond each day during long test
programs, but after establishing an initial good setup, I never saw the bond
degrade.

 

I also used some LISN’s which used a single ¼-20 bolt as the ground point. I
used flexible copper straps with these LISN’s, with the only caveat being
that I used a large washer to clamp the strap against the LISN body instead
of relying solely on the threaded stud.

 

I was also very fond of the Keithley 580 Microohmmeter; it was stable and
reliable, although the spring-loaded Kelvin probes were delicate. I bought
various probe tips and alligator clips to make my own custom Kelvin probes;
take a look at http://www.probemaster.com/

 

Ed Price
WB6WSN
Chula Vista, CA USA
1961 Amphicar 770
2001 Fleetwood Storm 31W
2008 Ford Explorer

 

From: Chris Bramley [mailto:christopher.bram...@us.bureauveritas.com] 
Sent: Thursday, March 12, 2015 3:47 PM
To: EMC-PSTC@LISTSERV.IEEE.ORG
Subject: [PSES] LISN Bonding to Ground Plane for CEMI Testing per ANSI C63.4

 

ANSI C63.4-2014 clause 5.2.2 requires a direct current resistance of less
than or equal to 2.5 milliohms between the LISN being used for CEMI
measurements and the reference ground plane. Is it possible to achieve this
low level of resistance by simply bolting the LISN to the ground plane(after
thoroughly cleaning the LISN and ground plane contact points)? I am looking
for a solution that allows the LISNs to remain reasonably portable as they
are regularly transferred between test sites. Also, what combination of
Kelvin probes and milliohm meter works best to take quick, repeatable
measurements of the resistance between the LISN and the ground plane?

Christopher Bramley
EMC Test Engineer I
Bureau Veritas - Consumer Products Services
Littleton Distribution Center
1 Distribution Center Circle, Suite 1
Littleton, MA 01460, USA
978.486.8880 x6135
christopher.bram...@us.bureauveritas.com
 
This message contains confidential information. 
To know more, please click on the following link:
http://disclaimer.bureauveritas.com; 

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Re: [PSES] LISN Bonding to Ground Plane for CEMI Testing per ANSI C63.4

2015-03-13 Thread Ken Javor
At least in MIL-STD-461 and RTCA/DO-160 of which I have personal knowledge,
the EUT must be bonded to the ground plane in the same manner it would in
its intended installation.  I assume other standards do likewise, but the
point is that any sort of LISN provides a standard source impedance
specifically based on a controlled bonding impedance (NTE) whereas the test
sample performance depends on its specific grounding/boning configuration,
which the test set-up must replicate to the maximum extent possible.

Ken Javor
Phone: (256) 650-5261


 From: John Woodgate j...@jmwa.demon.co.uk
 Reply-To: John Woodgate j...@jmwa.demon.co.uk
 Date: Fri, 13 Mar 2015 14:47:28 +
 To: EMC-PSTC@LISTSERV.IEEE.ORG
 Subject: Re: [PSES] LISN Bonding to Ground Plane for CEMI Testing per ANSI
 C63.4
 
 In message d1285ee5.69ff8%ken.ja...@emccompliance.com, dated Fri, 13
 Mar 2015, Ken Javor ken.ja...@emccompliance.com writes:
 
 A ground plane made of copper, brass or aluminum of any extent (width
 as well as length) will have microohms of resistance
 
 I wonder if that's always true when you take into account the contact
 between the EUT and the ground plane, not just the ground plane itself.
 -- 
 OOO - Own Opinions Only. With best wishes. See www.jmwa.demon.co.uk
 When I turn my back on the sun, it's to look for a rainbow
 John Woodgate, J M Woodgate and Associates, Rayleigh, Essex UK
 
 -
 
 This message is from the IEEE Product Safety Engineering Society emc-pstc
 discussion list. To post a message to the list, send your e-mail to
 emc-p...@ieee.org
 
 All emc-pstc postings are archived and searchable on the web at:
 http://www.ieee-pses.org/emc-pstc.html
 
 Attachments are not permitted but the IEEE PSES Online Communities site at
 http://product-compliance.oc.ieee.org/ can be used for graphics (in well-used
 formats), large files, etc.
 
 Website:  http://www.ieee-pses.org/
 Instructions:  http://www.ieee-pses.org/list.html (including how to
 unsubscribe)
 List rules: http://www.ieee-pses.org/listrules.html
 
 For help, send mail to the list administrators:
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 Mike Cantwell mcantw...@ieee.org
 
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 Jim Bacher:  j.bac...@ieee.org
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Re: [PSES] LISN Bonding to Ground Plane for CEMI Testing per ANSI C63.4

2015-03-12 Thread Ken Javor
All that is necessary is a clean metal-to-metal faying surface bond.  There
are any number of bond meters out there. Some of the old ones are the
HP4328A (which has a modern digital incarnation) and the Keithley Model 580
(which is also obsolete but has a modern replacement that likely someone
else on this forum can cite).

Ken Javor
Phone: (256) 650-5261



From: Chris Bramley christopher.bram...@us.bureauveritas.com
Reply-To: christopher.bram...@us.bureauveritas.com
Date: Thu, 12 Mar 2015 18:47:15 -0400
To: EMC-PSTC@LISTSERV.IEEE.ORG
Subject: [PSES] LISN Bonding to Ground Plane for CEMI Testing per ANSI C63.4

ANSI C63.4-2014 clause 5.2.2 requires a direct current resistance of less
than or equal to 2.5 milliohms between the LISN being used for CEMI
measurements and the reference ground plane. Is it possible to achieve this
low level of resistance by simply bolting the LISN to the ground plane(after
thoroughly cleaning the LISN and ground plane contact points)? I am looking
for a solution that allows the LISNs to remain reasonably portable as they
are regularly transferred between test sites. Also, what combination of
Kelvin probes and milliohm meter works best to take quick, repeatable
measurements of the resistance between the LISN and the ground plane?

Christopher Bramley
EMC Test Engineer I
Bureau Veritas - Consumer Products Services
Littleton Distribution Center
1 Distribution Center Circle, Suite 1
Littleton, MA 01460, USA
978.486.8880 x6135
christopher.bram...@us.bureauveritas.com
 
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Attachments are not permitted but the IEEE PSES Online Communities site at 
http://product-compliance.oc.ieee.org/ can be used for graphics (in well-used 
formats), large files, etc.

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[PSES] LISN Bonding to Ground Plane for CEMI Testing per ANSI C63.4

2015-03-12 Thread Chris Bramley


ANSI C63.4-2014 clause 5.2.2 requires a direct current resistance of less
than or equal to 2.5 milliohms between the LISN being used for CEMI
measurements and the reference ground plane. Is it possible to achieve this
low level of resistance by simply bolting the LISN to the ground plane
(after thoroughly cleaning the LISN and ground plane contact points)? I am
looking for a solution that allows the LISNs to remain reasonably portable
as they are regularly transferred between test sites. Also, what
combination of Kelvin probes and milliohm meter works best to take quick,
repeatable measurements of the resistance between the LISN and the ground
plane?

Christopher Bramley
EMC Test Engineer I
Bureau Veritas - Consumer Products Services
Littleton Distribution Center
1 Distribution Center Circle, Suite 1
Littleton, MA 01460, USA
978.486.8880 x6135
christopher.bram...@us.bureauveritas.com

This message contains confidential information.
To know more, please click on the following link:
http://disclaimer.bureauveritas.com;
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This message is from the IEEE Product Safety Engineering Society emc-pstc 
discussion list. To post a message to the list, send your e-mail to 
emc-p...@ieee.org

All emc-pstc postings are archived and searchable on the web at:
http://www.ieee-pses.org/emc-pstc.html

Attachments are not permitted but the IEEE PSES Online Communities site at 
http://product-compliance.oc.ieee.org/ can be used for graphics (in well-used 
formats), large files, etc.

Website:  http://www.ieee-pses.org/
Instructions:  http://www.ieee-pses.org/list.html (including how to unsubscribe)
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Scott Douglas sdoug...@ieee.org
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For policy questions, send mail to:
Jim Bacher:  j.bac...@ieee.org
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