Re: gEDA-user: random project idea

2008-04-06 Thread Levente
On Sat, 05 Apr 2008 09:28:43 -0500
John Griessen [EMAIL PROTECTED] wrote:

 Levente wrote:
 
  http://web.interware.hu/lekovacs/reflow_oven/index.html
  
  Actually, it is an electric heater. The problem is that the heat exchange
  is slow, and it can't maintain the slopes coming from the heat profile. I
  use a PT100 thermo-sensor mounted on a pice of PCB (not the PCB being
  reflowed.)
 
 Can you increase the number of heater rods?

Well, yes. The triac can switch 20Amps on 230V that is plenty of power. I
am thinking of some heat shield around the oven. That could reflect IR power
to the board, increasing the efficiency.


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Re: gEDA-user: random project idea

2008-04-05 Thread Levente
On Sat, 29 Mar 2008 09:19:50 -0500
John Griessen [EMAIL PROTECTED] wrote:

 Steve Meier wrote:
  An interesting hobbyist project might be to modify a hot plate to be
  computer controlled with a thermal couple feed back loop to meet
  Altera's requirements.
 
 Levente has a design for a toaster controller I think he'll share.

http://web.interware.hu/lekovacs/reflow_oven/index.html

Actually, it is an electric heater. The problem is that the heat exchange is
slow, and it can't maintain the slopes coming from the heat profile. I use a
PT100 thermo-sensor mounted on a pice of PCB (not the PCB being reflowed.)

The software is a quck and dirty hack, and should be rewritten.

Cheers,

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Re: gEDA-user: random project idea

2008-04-05 Thread John Griessen
Levente wrote:

 http://web.interware.hu/lekovacs/reflow_oven/index.html
 
 Actually, it is an electric heater. The problem is that the heat exchange is
 slow, and it can't maintain the slopes coming from the heat profile. I use a
 PT100 thermo-sensor mounted on a pice of PCB (not the PCB being reflowed.)

Can you increase the number of heater rods?

John Griessen

-- 
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Re: gEDA-user: random project idea

2008-03-29 Thread John Griessen
Steve Meier wrote:

 Isn't the switch to rohs soldering a bigger issue?

There's a rumor that there is a RoHS exception for package leg pitches of 0.5mm 
and under,
meaning all you do to get exemption is put such a part on your board...

There's an email list of people documenting soldering trouble so RoHS can be 
argued against scientifically.
[EMAIL PROTECTED]

John Griessen

Ecosensory   Austin TX
tinyOS devel on:  ubuntu Linux;   tinyOS v2.0.2;   telosb ecosens1


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Re: gEDA-user: random project idea

2008-03-29 Thread John Griessen
Steve Meier wrote:
 An interesting hobbyist project might be to modify a hot plate to be
 computer controlled with a thermal couple feed back loop to meet
 Altera's requirements.

Levente has a design for a toaster controller I think he'll share.

John Griessen

-- 
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Re: gEDA-user: random project idea

2008-03-28 Thread Hagen SANKOWSKI
Hallo.

Am 28.03.2008 um 06:51 schrieb Jesse Gordon:

 Can you please tell me a little more about meta-FPGA? I have no idea
 what it means, but I was talking with someone (who knows slightly more
 about fpgas then I, which still isn't much) a while back the general
 idea of constructing an fpga inside an fpga, such that once a
 high-gate-count fpga were programmed, it would function as a much
 smaller fpga who's internal workings would be well documented and open
 source, allowing hobbyists to experiment with completely free tools,  
 and
 perhaps some day a real fpga company would build a native one.


Well, the main reason for Meta-FPGA is the hidden bitstream formats  
for nearly all vendors and the commercial vendor tools in the chain.
The idea point out, that it would be possible to develop out a fpga  
structure, which is free in all meanings. Free tools would offer a  
tool chain to synthesis, place and route on this free fpga structure.  
The commercial vendor tools still once a time in need, when the free  
fpga structure is synthesised, placed and routed on the commercial  
fpga families. Nice idea i think but until now not realized.. I would  
think, the main reasons are:

* you need nearly 10 to 100 more gate-array to build one gate on the  
fpga.
This means, the Meta-FPGA structure contains 1/10 to 1/100 less gate  
ressources then the buyed one.

* practically all realizations of fpga structure, routing ressources,  
look-up tables etc are well patented.
In fact, this prevent us to develop a free fpga structure with out  
violating one of this patents. Otherwise we would find a ground- 
breaking new structure for the fpga.

I think the patent issue is a bigger show stopper. Here we are  
stepping in the field of real hardware, there are a lot of more  
patents than software developer may thinking off. I did a lot  
investigation in the fpga topic - and still dream of a free one!

Regards,
Hagen Sankowski


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Re: gEDA-user: random project idea

2008-03-28 Thread Steve Meier
High speed memory is now staggering the transmission of each data line
to minimize cross talk. High end fpga's can support qdr II memory
devices to clock speeds of over 500 MHz. The qdr ii has two data buses
one for read and one for writing. Each bus supports a transfer on each
edge of the clock. This implies data rates on these buses of over 1 GHz.

It isn't the bus rate that will limit performance it is the internal
clock rate. 500 MHz as opposed to over 3 GHZ.

However, the fpga has all those built in multipliers hundreds of
them. So for certain tasks an fpga will completely blow away a standard
intel based computer.

My inclination would be to build a mother board with both a standard
microprocessor and an additional fpga that can be programed by the
microprocessor. A customized coprocessor so to speak.

Steve Meier




On Thu, 2008-03-27 at 19:08 -0400, DJ Delorie wrote:
  My understanding is that with the GHz busses on modern mobos you need
 
 With a soft CPU, the busses can go slower.  I wouldn't expect such a
 project to compete with PCs.
 
  I thought it was basically impossible to get it right without
  assistance from the CAD tool.
 
 Well, we can change the CAD tool, can't we?  ;-)
 
  Is this actually practically feasible with a dumb CAD tool like
  pcb?
 
 You'd have to limit yourself to something that fits in our skill set,
 sure, but perhaps a less-than-GHz system would be doable.  It would be
 neat to experiment with other cores and stuff besides the usual x86,
 arm, and mips.  Imagine a picoblaze PC running something like DOS, or
 a nios-linux box.
 
  But it's dumb in the sense that it doesn't really contribute to
  the layout,
 
 It does have trace measuring, though.
 
 
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Re: gEDA-user: random project idea

2008-03-28 Thread Steven Michalske

On Mar 28, 2008, at 10:10 AM, Steve Meier wrote:

 High speed memory is now staggering the transmission of each data line
 to minimize cross talk. High end fpga's can support qdr II memory
 devices to clock speeds of over 500 MHz. The qdr ii has two data buses
 one for read and one for writing. Each bus supports a transfer on each
 edge of the clock. This implies data rates on these buses of over 1  
 GHz.

 It isn't the bus rate that will limit performance it is the internal
 clock rate. 500 MHz as opposed to over 3 GHZ.


when you move to serial data buses they have PLL clock multipliers  
that make the serial stream operate at high frequencies.
so the I/O speed can be higher than the fabric speed.

hardkrash

 However, the fpga has all those built in multipliers hundreds of
 them. So for certain tasks an fpga will completely blow away a  
 standard
 intel based computer.

 My inclination would be to build a mother board with both a standard
 microprocessor and an additional fpga that can be programed by the
 microprocessor. A customized coprocessor so to speak.

 Steve Meier




 On Thu, 2008-03-27 at 19:08 -0400, DJ Delorie wrote:
 My understanding is that with the GHz busses on modern mobos you  
 need

 With a soft CPU, the busses can go slower.  I wouldn't expect such a
 project to compete with PCs.

 I thought it was basically impossible to get it right without
 assistance from the CAD tool.

 Well, we can change the CAD tool, can't we?  ;-)

 Is this actually practically feasible with a dumb CAD tool like
 pcb?

 You'd have to limit yourself to something that fits in our skill set,
 sure, but perhaps a less-than-GHz system would be doable.  It would  
 be
 neat to experiment with other cores and stuff besides the usual x86,
 arm, and mips.  Imagine a picoblaze PC running something like DOS, or
 a nios-linux box.

 But it's dumb in the sense that it doesn't really contribute to
 the layout,

 It does have trace measuring, though.


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Re: gEDA-user: random project idea

2008-03-28 Thread John Griessen
Jesse Gordon wrote:
 
 Igor2 wrote:
 If we are at tools, I wonder... Is there an FPGA family that I could use
 without using non-free software at all?

Google Slipway.  The author says it's not quite ready for building things
that are needing reliability and he's busy on a contract job, so it's a ways 
off, really.

John G

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Re: gEDA-user: random project idea

2008-03-28 Thread John Griessen
Larry Doolittle wrote:

 Also as a curiosity, see Reinoud's MPGA, an open source meta-FPGA.
 That one seems to have dropped off the 'net.  Does anyone have an
 archived copy?

I may.  I'lll rummage on my hard drive.   I liked that concept.
You could take a normal FPGA and develop one meta layer program for it
with the company's tools, and hire it done if need be, the just program the 
meta layer
as an open FPGA from then on...

John G
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Re: gEDA-user: random project idea

2008-03-28 Thread John Griessen
Hagen SANKOWSKI wrote:
I think the patent issue is a bigger show stopper. Here we are
 stepping in the field of real hardware, there are a lot of more  
 patents than software developer may thinking off. I did a lot  
 investigation in the fpga topic - and still dream of a free one!

FPGAs are now twenty-five years old.   Hang in there, and
research those old patents -- there'll be a way, but it still is a big task
not easily done by amateurs all over the planet...but there's MOSIS...


John Griessen

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Re: gEDA-user: random project idea

2008-03-28 Thread DJ Delorie

 6/6 is doable if you slightly cheat the size of the solder pads.

The problem is the vias - a 12 mil hole with 6 mil rules is a 24 mil
via pad, with only 39 mil on center (1mm) that leaves 15 mil between
vias, which is enough for a 5/5 trace but not a 6/6 trace.

So with 6/6 rules, you're limited to the outer THREE rows, not the
outer FOUR.

Unless there's some trick for staggering the vias to make more room?


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Re: gEDA-user: random project idea

2008-03-28 Thread Steve Meier
I have routed a 900 pin bga 1mm pitch on 4 signal layers.

30x30

using Larry's math

30/2 - 2 = 13 layers this seems pessimistic. 

for details see
 
http://archives.seul.org/geda/user/Jan-2005/msg00196.html


Steve M.

On Thu, 2008-03-27 at 17:21 -0700, Larry Doolittle wrote:
 Guys -
 
 On Thu, Mar 27, 2008 at 04:22:34PM -0700, Jesse Gordon wrote:
  DJ Delorie wrote:
http://www.xilinx.com/products/boards/ml410/index.html
  They have a lot of support chips on that board, though.  Like the
  south bridge, CF controller, PCI bridge, etc.  I was thinking more
  like every connector goes directly to an FPGA pin.  Maybe one fpga
  for the cpu core and one for the peripherals, though.

  I like the idea. If the main FPGA was big enough, maybe it'd only need  
  one, but I guess we're trying to avoid
  more then 4 layers, and big bga=more then 4 layers.
 
  But if two fpgas were sitting right besides eachother, with about 25  
  pins lining up, and just connected right together, (with qfp) the run  
  would be short, straight, and all the same length, it could be over  
  ground-plane layer there. I think considerable fpga-fpga speeds could be  
  attained. If the run was short enough, it may
  /work/ without termination. By having several such fpgas in a row, each  
  connected likewise to the one near it, or maybe having 1 in the middle  
  then 4 around it, one on each side, I'm sure enough pins could be  
  attained to feed all the peripherals.
 
  It may even be doable on a 2 layer board, but four is much more then  
  twice as good as 2.
  (I think it's more then twice the cost too :-)
 
  Interfacing to the ram at high speeds could be tricky, so it might be  
  better to have the ram in parallel (wider data bus) rather then longer  
  address space,
  to allow faster byte/sec without faster addresses/second.
 
 All interesting ideas, but fundamentally not new.  The bigger/faster/cheaper
 FPGAs get, the more interesting it gets.  A few comments on details:
 
 1. Self-reconfigurable FPGAs have been promised for years, but aren't
 ready, and probably never will be.  Think carefully about the boot
 sequence, and how one FPGA can boot the next.  Having more than one
 FPGA is probably a good thing.
 
 2. For Ethernet, you don't want a PHY+MAC, just a PHY.  The pin count
 is lower and the result is more FPGA-like.  I have a demo of
 Gigabit-compatible IP/ARP/UDP in 200 cells plus 32 kbits RAM.
 I will probably even work on making it useful for real-time
 communications in the next year.
 
 3. A large BGA can be useful even without a lot of board layers.
 Assume 1mm pitch and 5/5 space/trace.  In concept, reaching all
 n^2 pads can take approximately n/2-2 routing layers, although that's
 an overestimate because many interior pads are power and ground.
 Practically, it takes six layers for 170 user I/O on a 256-pad BGA,
 and the layer count rises rapidly for those 600 to 1200 pad monsters.
 If you only route the outer four rows, however, you get 16*(n-4)
 pads with two routing layers (four physical layers with power/ground).
 A 676-pad package (26x26) gives you 352 routable pads like that.
 
 4. You can do a lot with FPGA plus DDR SDRAM, outside of traditional
 CPU design.  Just look at Elphel's model 333 camera.
   http://www3.elphel.com/
 Ogg Theora _en_coding faster than most PC's can _de_code it.
 
 5. I have always been impressed by Jan Gray's CPU in FPGA designs.
   http://fpgacpu.org/
 Jan himself has moved on to other work.  If anyone wants to talk shop
 about CPUs in FPGA, like how to add Cache, MMU, and SDRAM to a 32-bit
 Gray-esque processor, let's find a better list.
 
   - Larry
 
 
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Re: gEDA-user: random project idea

2008-03-28 Thread Steve Meier
ah it assumes all pins are io and that you can only get one trace
between rows?

Realistically, the center pins are power and ground with io allong the
edges.

so lets say for a row the center half of the pins are power and ground
and you can get two traces between rows.

max signal layers = (n/2 - 2) / 2 

n/2 says half the pins are io

-2 says on an outer surface we can touch the outer io pad with a trace.

/ 2 says we can place two traces between each row


Steve M.

On Fri, 2008-03-28 at 11:43 -0700, Steve Meier wrote:
 I have routed a 900 pin bga 1mm pitch on 4 signal layers.
 
 30x30
 
 using Larry's math
 
 30/2 - 2 = 13 layers this seems pessimistic. 
 
 for details see
  
 http://archives.seul.org/geda/user/Jan-2005/msg00196.html
 
 
 Steve M.
 
 On Thu, 2008-03-27 at 17:21 -0700, Larry Doolittle wrote:
  Guys -
  
  On Thu, Mar 27, 2008 at 04:22:34PM -0700, Jesse Gordon wrote:
   DJ Delorie wrote:
 http://www.xilinx.com/products/boards/ml410/index.html
   They have a lot of support chips on that board, though.  Like the
   south bridge, CF controller, PCI bridge, etc.  I was thinking more
   like every connector goes directly to an FPGA pin.  Maybe one fpga
   for the cpu core and one for the peripherals, though.
 
   I like the idea. If the main FPGA was big enough, maybe it'd only need  
   one, but I guess we're trying to avoid
   more then 4 layers, and big bga=more then 4 layers.
  
   But if two fpgas were sitting right besides eachother, with about 25  
   pins lining up, and just connected right together, (with qfp) the run  
   would be short, straight, and all the same length, it could be over  
   ground-plane layer there. I think considerable fpga-fpga speeds could be  
   attained. If the run was short enough, it may
   /work/ without termination. By having several such fpgas in a row, each  
   connected likewise to the one near it, or maybe having 1 in the middle  
   then 4 around it, one on each side, I'm sure enough pins could be  
   attained to feed all the peripherals.
  
   It may even be doable on a 2 layer board, but four is much more then  
   twice as good as 2.
   (I think it's more then twice the cost too :-)
  
   Interfacing to the ram at high speeds could be tricky, so it might be  
   better to have the ram in parallel (wider data bus) rather then longer  
   address space,
   to allow faster byte/sec without faster addresses/second.
  
  All interesting ideas, but fundamentally not new.  The bigger/faster/cheaper
  FPGAs get, the more interesting it gets.  A few comments on details:
  
  1. Self-reconfigurable FPGAs have been promised for years, but aren't
  ready, and probably never will be.  Think carefully about the boot
  sequence, and how one FPGA can boot the next.  Having more than one
  FPGA is probably a good thing.
  
  2. For Ethernet, you don't want a PHY+MAC, just a PHY.  The pin count
  is lower and the result is more FPGA-like.  I have a demo of
  Gigabit-compatible IP/ARP/UDP in 200 cells plus 32 kbits RAM.
  I will probably even work on making it useful for real-time
  communications in the next year.
  
  3. A large BGA can be useful even without a lot of board layers.
  Assume 1mm pitch and 5/5 space/trace.  In concept, reaching all
  n^2 pads can take approximately n/2-2 routing layers, although that's
  an overestimate because many interior pads are power and ground.
  Practically, it takes six layers for 170 user I/O on a 256-pad BGA,
  and the layer count rises rapidly for those 600 to 1200 pad monsters.
  If you only route the outer four rows, however, you get 16*(n-4)
  pads with two routing layers (four physical layers with power/ground).
  A 676-pad package (26x26) gives you 352 routable pads like that.
  
  4. You can do a lot with FPGA plus DDR SDRAM, outside of traditional
  CPU design.  Just look at Elphel's model 333 camera.
http://www3.elphel.com/
  Ogg Theora _en_coding faster than most PC's can _de_code it.
  
  5. I have always been impressed by Jan Gray's CPU in FPGA designs.
http://fpgacpu.org/
  Jan himself has moved on to other work.  If anyone wants to talk shop
  about CPUs in FPGA, like how to add Cache, MMU, and SDRAM to a 32-bit
  Gray-esque processor, let's find a better list.
  
- Larry
  
  
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Re: gEDA-user: random project idea

2008-03-28 Thread Steve Meier
Again pessimistic.

max signal layers = (n/2 - 2) / 2 / 2

the last / 2 says I get to work of of each edge of the device.

So I should have been able to route a 900 pin fpga on 4 layers. at least
as far as clearing the fpga.

If we don't use via in pads we loose the two outer layers for routing to
the inner io pads.

max signal layers = ((n/2 - 2) / 2 / 2) + 2

and we have to make up for them with additional signal layers.

Steve Meier

On Fri, 2008-03-28 at 11:53 -0700, Steve Meier wrote:
 ah it assumes all pins are io and that you can only get one trace
 between rows?
 
 Realistically, the center pins are power and ground with io allong the
 edges.
 
 so lets say for a row the center half of the pins are power and ground
 and you can get two traces between rows.
 
 max signal layers = (n/2 - 2) / 2 
 
 n/2 says half the pins are io
 
 -2 says on an outer surface we can touch the outer io pad with a trace.
 
 / 2 says we can place two traces between each row
 
 
 Steve M.
 
 On Fri, 2008-03-28 at 11:43 -0700, Steve Meier wrote:
  I have routed a 900 pin bga 1mm pitch on 4 signal layers.
  
  30x30
  
  using Larry's math
  
  30/2 - 2 = 13 layers this seems pessimistic. 
  
  for details see
   
  http://archives.seul.org/geda/user/Jan-2005/msg00196.html
  
  
  Steve M.
  
  On Thu, 2008-03-27 at 17:21 -0700, Larry Doolittle wrote:
   Guys -
   
   On Thu, Mar 27, 2008 at 04:22:34PM -0700, Jesse Gordon wrote:
DJ Delorie wrote:
  http://www.xilinx.com/products/boards/ml410/index.html
They have a lot of support chips on that board, though.  Like the
south bridge, CF controller, PCI bridge, etc.  I was thinking more
like every connector goes directly to an FPGA pin.  Maybe one fpga
for the cpu core and one for the peripherals, though.
  
I like the idea. If the main FPGA was big enough, maybe it'd only need  
one, but I guess we're trying to avoid
more then 4 layers, and big bga=more then 4 layers.
   
But if two fpgas were sitting right besides eachother, with about 25  
pins lining up, and just connected right together, (with qfp) the run  
would be short, straight, and all the same length, it could be over  
ground-plane layer there. I think considerable fpga-fpga speeds could 
be  
attained. If the run was short enough, it may
/work/ without termination. By having several such fpgas in a row, each 
 
connected likewise to the one near it, or maybe having 1 in the middle  
then 4 around it, one on each side, I'm sure enough pins could be  
attained to feed all the peripherals.
   
It may even be doable on a 2 layer board, but four is much more then  
twice as good as 2.
(I think it's more then twice the cost too :-)
   
Interfacing to the ram at high speeds could be tricky, so it might be  
better to have the ram in parallel (wider data bus) rather then longer  
address space,
to allow faster byte/sec without faster addresses/second.
   
   All interesting ideas, but fundamentally not new.  The 
   bigger/faster/cheaper
   FPGAs get, the more interesting it gets.  A few comments on details:
   
   1. Self-reconfigurable FPGAs have been promised for years, but aren't
   ready, and probably never will be.  Think carefully about the boot
   sequence, and how one FPGA can boot the next.  Having more than one
   FPGA is probably a good thing.
   
   2. For Ethernet, you don't want a PHY+MAC, just a PHY.  The pin count
   is lower and the result is more FPGA-like.  I have a demo of
   Gigabit-compatible IP/ARP/UDP in 200 cells plus 32 kbits RAM.
   I will probably even work on making it useful for real-time
   communications in the next year.
   
   3. A large BGA can be useful even without a lot of board layers.
   Assume 1mm pitch and 5/5 space/trace.  In concept, reaching all
   n^2 pads can take approximately n/2-2 routing layers, although that's
   an overestimate because many interior pads are power and ground.
   Practically, it takes six layers for 170 user I/O on a 256-pad BGA,
   and the layer count rises rapidly for those 600 to 1200 pad monsters.
   If you only route the outer four rows, however, you get 16*(n-4)
   pads with two routing layers (four physical layers with power/ground).
   A 676-pad package (26x26) gives you 352 routable pads like that.
   
   4. You can do a lot with FPGA plus DDR SDRAM, outside of traditional
   CPU design.  Just look at Elphel's model 333 camera.
 http://www3.elphel.com/
   Ogg Theora _en_coding faster than most PC's can _de_code it.
   
   5. I have always been impressed by Jan Gray's CPU in FPGA designs.
 http://fpgacpu.org/
   Jan himself has moved on to other work.  If anyone wants to talk shop
   about CPUs in FPGA, like how to add Cache, MMU, and SDRAM to a 32-bit
   Gray-esque processor, let's find a better list.
   
 - Larry
   
   
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Re: gEDA-user: random project idea

2008-03-28 Thread DJ Delorie

 Cheating? I did that board when pcb only

I meant that hobby folks can rarely afford to have via-in-pad done.
Unless there's some way to hand-prep each via so the bga can be
soldered on.  Otherwise, we need to either stick with normal rules
or avoid BGAs altogether.

 The real issue here separation the hobbyist from the professional is the
 cost of the components. Boards of this nature are likely to run into the
 thousands of dollars each for small quantities (pcb fabrication,
 components and assembly).

Yup.  I think technology has gotten to the point where the hobbyist
can make *a* motherboard, but not a leading edge one.


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Re: gEDA-user: random project idea

2008-03-28 Thread Larry Doolittle
Steve -

On Fri, Mar 28, 2008 at 10:27:28AM -0700, Steve Meier wrote:
 On Fri, 2008-03-28 at 10:20 -0700, Larry Doolittle wrote:
  OK.  Just be sure to give the FPGA direct access (via PHY) to
  Ethernet.  The same concept also applies to network performance.
  I'd venture to say you want four RJ-45's: two for the traditional
  microprocessor and two for the FPGA.
 
 Good idea add to that taking advantage of the optical networking
 capabilities of the fpgas.

If you're willing to make the jump from $30 to $300 FPGAs,
that is.  The cheap ones don't have the high speed serial
capability.

   - Larry


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Re: gEDA-user: random project idea

2008-03-28 Thread Steve Meier
Cheating? I did that board when pcb only supported 8 layers so yep lie
steal cheat grand larceny I did what ever I could to make it fit ;) And
I am still thrilled that the difference between detection on the analog
channels was less then 10 pico seconds. Far below what we could directly
measure on a high end lecroy scope.

Looking at the image it appears that there were as many as 8 rows deep
of io from the edge. so 8 - 1 = 7 rows of inner io / 2 = 3.5 layers.

for 7 rows of io 7 - 1 = 6 rows of inner io / 2 = 3 layers. So in
general I agree that 7 rows of io depth can be squeezed into 3 layers,
however getting to the edge of the fpga is just the start then you have
to reach all the devices and the fpga itself has configuration pins
scattered in such a manner as to interfere with neat orderly math.

In reality there is also a relationship to board component surface area
density and the number of signal layers you have to arrange traces.
Fewer signal layers tends to force your components further apart.

Yea about getting 6 voltage layers and 2 ground layers into the
remaining 4 layers. 

I do recommend rethinking only one trace between rows especially for
anyone using differential IO. 

The real issue here separation the hobbyist from the professional is the
cost of the components. Boards of this nature are likely to run into the
thousands of dollars each for small quantities (pcb fabrication,
components and assembly).

Steve M.

On Fri, 2008-03-28 at 15:08 -0400, DJ Delorie wrote:
 Ok, you're cheating by using via-in pad ;-)
 
 I think the generic breakout (at least for us hobby types) is one
 trace between pads, and one between vias.  So you can bring out two
 (signal) rows on top, two rows (through vias) to some other layer, and
 one more row for each additional layer.  In your example, you're
 bringing out eight signal rows, so: two on top, two on next, and four
 more layers for the rest, or six signal layers.
 
 If you can get two traces between pads, that's an extra row that can
 come out on top.
 
 If you can get two traces between vias, it's three rows for the first
 non-top layer, and two rows for each layer beyond that.  For your
 example, that's three on top, three on next, and one more layer for
 the next two.  You should have been able to do it with only three
 signal layers.
 
   between:1   1/2 2
 signal rows
 ---
 1 1   1   1
 2 1   1   1
 3 2   1   1
 4 2   2   2
 5 3   2   2
 6 4   3   2
 7 5   4   3
 8 6   5   3
 9 7   6   4
 108   7   4
 
 None of this includes the power block at the center, or other power
 pins.



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Re: gEDA-user: random project idea

2008-03-28 Thread Steve Meier
My understanding is that the backside of the via hole pattern is filled
with an epoxy which prevents the chimney effect (heat rising through the
via and sucking/wicking the solder down into the via). I think that
should be doable by a hobbyist.

Isn't the switch to rohs soldering a bigger issue?

Steve Meier


On Fri, 2008-03-28 at 15:43 -0400, DJ Delorie wrote:
  Cheating? I did that board when pcb only
 
 I meant that hobby folks can rarely afford to have via-in-pad done.
 Unless there's some way to hand-prep each via so the bga can be
 soldered on.  Otherwise, we need to either stick with normal rules
 or avoid BGAs altogether.
 
  The real issue here separation the hobbyist from the professional is the
  cost of the components. Boards of this nature are likely to run into the
  thousands of dollars each for small quantities (pcb fabrication,
  components and assembly).
 
 Yup.  I think technology has gotten to the point where the hobbyist
 can make *a* motherboard, but not a leading edge one.



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Re: gEDA-user: random project idea

2008-03-28 Thread DJ Delorie

 Isn't the switch to rohs soldering a bigger issue?

As in we don't have to ? :-)


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Re: gEDA-user: random project idea

2008-03-28 Thread Steve Meier
Well not yet at least not here in the US how about our European friends
though?


On Fri, 2008-03-28 at 16:26 -0400, DJ Delorie wrote:
  Isn't the switch to rohs soldering a bigger issue?
 
 As in we don't have to ? :-)



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Re: gEDA-user: random project idea

2008-03-28 Thread Steve Meier
Also, even we in the US won't be able to get leaded bga's for ever.


On Fri, 2008-03-28 at 16:26 -0400, DJ Delorie wrote:
  Isn't the switch to rohs soldering a bigger issue?
 
 As in we don't have to ? :-)



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Re: gEDA-user: random project idea

2008-03-28 Thread DJ Delorie

 Well not yet at least not here in the US how about our European
 friends though?

I was thinking more of hobbyists have less restrictions than
commercial as far as ROHS goes.  At least, that's if we can *get*
non-ROHS parts.  I don't mind ROHS parts as long as I can use 63/37
solder.


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Re: gEDA-user: random project idea

2008-03-28 Thread Steve Meier
I have seen rohs bga's where the balls have been removed and reballed
with leaded balls. Seems like a risky extra step to avoid the
temperature requirements. How hot does your hot plate get?

Steve M.


On Fri, 2008-03-28 at 16:34 -0400, DJ Delorie wrote:
  Well not yet at least not here in the US how about our European
  friends though?
 
 I was thinking more of hobbyists have less restrictions than
 commercial as far as ROHS goes.  At least, that's if we can *get*
 non-ROHS parts.  I don't mind ROHS parts as long as I can use 63/37
 solder.



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Re: gEDA-user: random project idea

2008-03-28 Thread DJ Delorie

 I have seen rohs bga's where the balls have been removed and
 reballed with leaded balls. Seems like a risky extra step to avoid
 the temperature requirements. How hot does your hot plate get?

Hot enough, I think.  I haven't had a chance to see how hot it gets -
I just remove the board once the solder melts.  It's not like it's a
controlled temperature source or anything.

But as it's not controlled, lead solder gives me more elbow room.


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Re: gEDA-user: random project idea

2008-03-28 Thread DJ Delorie

 An interesting hobbyist project might be to modify a hot plate to be
 computer controlled with a thermal couple feed back loop to meet
 Altera's requirements.

I've been thinking of having a friend machine off the cast iron top
half and bolt on an aluminum disk, so that it heats faster and more
evently, and adding thermocouples at that point.  But the reality is,
it pretty much just works for me at the moment, and it was only $20.


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Re: gEDA-user: random project idea

2008-03-28 Thread Kai-Martin Knaak
On Fri, 28 Mar 2008 13:28:22 -0700, Steve Meier wrote:

 Well not yet at least not here in the US how about our European friends
 though?

It took me quite a while to find a decent non-lead solder that produces 
smooth reliable connections when hand soldered. Standard SAC sucks. The 
guys at Balver did some metallurgy magic and came up with SN100. Never 
returned to lead since I got it directly from manufacturer. I managed to 
avoid BGAs though.

---(kaimartin)---
-- 
Kai-Martin Knaak
http://lilalaser.de/blog



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Re: gEDA-user: random project idea

2008-03-27 Thread Jean-Francois Blavier
DJ Delorie [EMAIL PROTECTED] wrote:


 ATX motherboard (or any pc motherboard shape, really, like micro-atx
 or some laptop).  PCI/PCIe slots, ISA slots, standard connectors,
 SDRAM - whatever.

 A huge FPGA in the middle.

 Or two or three big QFP ones.

 100% synthetic circuitry, including a soft CPU, in a PC case.

Sounds a lot like the Xilinx ML410:

  http://www.xilinx.com/products/boards/ml410/index.html

Cheers,

Jean-Francois


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Re: gEDA-user: random project idea

2008-03-27 Thread Randall Nortman
On Thu, Mar 27, 2008 at 06:36:38PM -0400, DJ Delorie wrote:
 
 ATX motherboard (or any pc motherboard shape, really, like micro-atx
 or some laptop).  PCI/PCIe slots, ISA slots, standard connectors,
 SDRAM - whatever.
 
 A huge FPGA in the middle.
[...]

My understanding is that with the GHz busses on modern mobos you need
to pay serious attention to matching trace lengths and impedances
exactly for the different lines of the bus.  I thought it was
basically impossible to get it right without assistance from the CAD
tool.

Am I wrong?  Is this actually practically feasible with a dumb CAD
tool like pcb?  No offense, really -- I love pcb!  But it's dumb in
the sense that it doesn't really contribute to the layout, just does a
pretty good job of letting you do the layout.  I've never had much
luck with the autorouter even for moderately complex stuff, nevermind
creating balanced busses.

-- 
Randall


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Re: gEDA-user: random project idea

2008-03-27 Thread Mark Rages
On Thu, Mar 27, 2008 at 5:36 PM, DJ Delorie [EMAIL PROTECTED] wrote:

  ATX motherboard (or any pc motherboard shape, really, like micro-atx
  or some laptop).  PCI/PCIe slots, ISA slots, standard connectors,
  SDRAM - whatever.

  A huge FPGA in the middle.

  Or two or three big QFP ones.

  100% synthetic circuitry, including a soft CPU, in a PC case.

  If it's designed for QFP FPGAs we might be able to get away with a
  four layer board, just choose pins wisely.

  Ok, back to sanity now...


http://geekz.co.uk/lovesraymond/archive/taking-freedom-further

-- 
Mark Rages, Engineer
Midwest Telecine LLC
[EMAIL PROTECTED]


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Re: gEDA-user: random project idea

2008-03-27 Thread DJ Delorie

 My understanding is that with the GHz busses on modern mobos you need

With a soft CPU, the busses can go slower.  I wouldn't expect such a
project to compete with PCs.

 I thought it was basically impossible to get it right without
 assistance from the CAD tool.

Well, we can change the CAD tool, can't we?  ;-)

 Is this actually practically feasible with a dumb CAD tool like
 pcb?

You'd have to limit yourself to something that fits in our skill set,
sure, but perhaps a less-than-GHz system would be doable.  It would be
neat to experiment with other cores and stuff besides the usual x86,
arm, and mips.  Imagine a picoblaze PC running something like DOS, or
a nios-linux box.

 But it's dumb in the sense that it doesn't really contribute to
 the layout,

It does have trace measuring, though.


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Re: gEDA-user: random project idea

2008-03-27 Thread DJ Delorie

 http://geekz.co.uk/lovesraymond/archive/taking-freedom-further

Yeah, that fits.


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Re: gEDA-user: random project idea

2008-03-27 Thread Jesse Gordon


DJ Delorie wrote:

  http://www.xilinx.com/products/boards/ml410/index.html



They have a lot of support chips on that board, though.  Like the
south bridge, CF controller, PCI bridge, etc.  I was thinking more
like every connector goes directly to an FPGA pin.  Maybe one fpga
for the cpu core and one for the peripherals, though.


  
I like the idea. If the main FPGA was big enough, maybe it'd only need 
one, but I guess we're trying to avoid

more then 4 layers, and big bga=more then 4 layers.

But if two fpgas were sitting right besides eachother, with about 25 
pins lining up, and just connected right together, (with qfp) the run 
would be short, straight, and all the same length, it could be over 
ground-plane layer there. I think considerable fpga-fpga speeds could be 
attained. If the run was short enough, it may
/work/ without termination. By having several such fpgas in a row, each 
connected likewise to the one near it, or maybe having 1 in the middle 
then 4 around it, one on each side, I'm sure enough pins could be 
attained to feed all the peripherals.


It may even be doable on a 2 layer board, but four is much more then 
twice as good as 2.

(I think it's more then twice the cost too :-)

Interfacing to the ram at high speeds could be tricky, so it might be 
better to have the ram in parallel (wider data bus) rather then longer 
address space,

to allow faster byte/sec without faster addresses/second.

-Jesse


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Re: gEDA-user: random project idea

2008-03-27 Thread Larry Doolittle
Guys -

On Thu, Mar 27, 2008 at 04:22:34PM -0700, Jesse Gordon wrote:
 DJ Delorie wrote:
   http://www.xilinx.com/products/boards/ml410/index.html
 They have a lot of support chips on that board, though.  Like the
 south bridge, CF controller, PCI bridge, etc.  I was thinking more
 like every connector goes directly to an FPGA pin.  Maybe one fpga
 for the cpu core and one for the peripherals, though.
   
 I like the idea. If the main FPGA was big enough, maybe it'd only need  
 one, but I guess we're trying to avoid
 more then 4 layers, and big bga=more then 4 layers.

 But if two fpgas were sitting right besides eachother, with about 25  
 pins lining up, and just connected right together, (with qfp) the run  
 would be short, straight, and all the same length, it could be over  
 ground-plane layer there. I think considerable fpga-fpga speeds could be  
 attained. If the run was short enough, it may
 /work/ without termination. By having several such fpgas in a row, each  
 connected likewise to the one near it, or maybe having 1 in the middle  
 then 4 around it, one on each side, I'm sure enough pins could be  
 attained to feed all the peripherals.

 It may even be doable on a 2 layer board, but four is much more then  
 twice as good as 2.
 (I think it's more then twice the cost too :-)

 Interfacing to the ram at high speeds could be tricky, so it might be  
 better to have the ram in parallel (wider data bus) rather then longer  
 address space,
 to allow faster byte/sec without faster addresses/second.

All interesting ideas, but fundamentally not new.  The bigger/faster/cheaper
FPGAs get, the more interesting it gets.  A few comments on details:

1. Self-reconfigurable FPGAs have been promised for years, but aren't
ready, and probably never will be.  Think carefully about the boot
sequence, and how one FPGA can boot the next.  Having more than one
FPGA is probably a good thing.

2. For Ethernet, you don't want a PHY+MAC, just a PHY.  The pin count
is lower and the result is more FPGA-like.  I have a demo of
Gigabit-compatible IP/ARP/UDP in 200 cells plus 32 kbits RAM.
I will probably even work on making it useful for real-time
communications in the next year.

3. A large BGA can be useful even without a lot of board layers.
Assume 1mm pitch and 5/5 space/trace.  In concept, reaching all
n^2 pads can take approximately n/2-2 routing layers, although that's
an overestimate because many interior pads are power and ground.
Practically, it takes six layers for 170 user I/O on a 256-pad BGA,
and the layer count rises rapidly for those 600 to 1200 pad monsters.
If you only route the outer four rows, however, you get 16*(n-4)
pads with two routing layers (four physical layers with power/ground).
A 676-pad package (26x26) gives you 352 routable pads like that.

4. You can do a lot with FPGA plus DDR SDRAM, outside of traditional
CPU design.  Just look at Elphel's model 333 camera.
  http://www3.elphel.com/
Ogg Theora _en_coding faster than most PC's can _de_code it.

5. I have always been impressed by Jan Gray's CPU in FPGA designs.
  http://fpgacpu.org/
Jan himself has moved on to other work.  If anyone wants to talk shop
about CPUs in FPGA, like how to add Cache, MMU, and SDRAM to a 32-bit
Gray-esque processor, let's find a better list.

  - Larry


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Re: gEDA-user: random project idea

2008-03-27 Thread DJ Delorie

 1. Self-reconfigurable FPGAs have been promised for years, but aren't
 ready, and probably never will be.  Think carefully about the boot
 sequence, and how one FPGA can boot the next.  Having more than one
 FPGA is probably a good thing.

What about the new flash-based FPGAs?  Maybe not as big, but they seem
to be instant-on.  I suppose we could have a CPLD sequence the
boot/reset/run sequence.

 Assume 1mm pitch and 5/5 space/trace.  In concept, reaching all

If we can fit it into 6/6 trace/space with 12 mil via holes, that's
within spec for common prototype fabs (pcb-pool, specifically, which
does 4 and 6 layer).  Of course, with QFP, you can hand solder the
chips and they easily fit in 6/6 rules.

 an overestimate because many interior pads are power and ground.

I looked up a spartan-3 FB676, which has 300k gates.  The five
innermost rows (100 balls) are all power/ground.  There are eight rows
after that; the outer four make up 352 balls, meaning we lose only
about 224 balls.  It's 1mm pitch, too.

Sweet.  Now, if I could solder those on my hotplate... :-)


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Re: gEDA-user: random project idea

2008-03-27 Thread John Griessen
Randall Nortman wrote:
   I thought it was
 basically impossible to get it right without assistance from the CAD
 tool.


PCIe keeps the signal lines differential and regular, so you have a chance.

The open graphics project is slowly moving along -- they are motivated by 
several partners
that hold the ultimate copyright to all the GPL parts and plan to make a 
fabless chip business of it.

The scope of the idea is so big, and the goal of motherboards is always speed, 
so it seems
not a match for open projects...  but maybe Xilinx would fund it for a while :-)

DJ Delorie wrote:
 I was thinking more
 like every connector goes directly to an FPGA pin.

I think it would max out at 400MHz thenthat's a routed-big-design FPGA 
logic speed limit, right?

Larry Doolittle wrote:
  1. Self-reconfigurable FPGAs have been promised for years, but aren't
  ready, and probably never will be.
[jg] I guess that's because the fpga makers seem to not want to let out their 
programming details -- probably because they
let Mentor and Synplicity and the like do all their tools and THEY don't want 
it let out.

JG

-- 
Ecosensory   Austin TX


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Re: gEDA-user: random project idea

2008-03-27 Thread DJ Delorie

Larry Doolittle [EMAIL PROTECTED] writes:
 Assume 1mm pitch and 5/5 space/trace.

Turns out Sierra can do this, for a fee.  A 7x7 4-layer board, with
5/5 rules and 12 mil holes, costs about $130ea qty5 if you don't mind
waiting for it.  Of course, that's a $650 investment, and you still
have to buy the FPGAs and figure out how to solder them on.


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Re: gEDA-user: random project idea

2008-03-27 Thread Larry Doolittle
On Thu, Mar 27, 2008 at 09:28:23PM -0500, John Griessen wrote:
 Larry Doolittle wrote:
   Self-reconfigurable FPGAs have been promised for years, but aren't
   ready, and probably never will be.
 I guess that's because the fpga makers seem to not want to let out their
 programming details -- probably because they let Mentor and Synplicity
 and the like do all their tools and THEY don't want it let out.

Tools are certainly part of the story.  But it also strikes me as
a chicken-and-egg problem.  The user's don't demand or exercise the
tools because of the conceptual problems and the silicon limitations.

On Thu, Mar 27, 2008 at 08:59:47PM -0400, DJ Delorie wrote:
 What about the new flash-based FPGAs?  Maybe not as big, but they seem
 to be instant-on.  I suppose we could have a CPLD sequence the
 boot/reset/run sequence.

Where the boot information is kept isn't as important as how to
reprogram it without risk of bricking the board.

 If we can fit it into 6/6 trace/space with 12 mil via holes, that's
 within spec for common prototype fabs (pcb-pool, specifically, which
 does 4 and 6 layer).

6/6 is doable if you slightly cheat the size of the solder pads.

 Now, if I could solder [a spartan-3 FB676] on my hotplate... :-)

I have seen instructions for home-soldering BGAs.  I haven't tried
them myself, and I don't know what the size limits are.

On Thu, Mar 27, 2008 at 09:34:27PM -0500, John Griessen wrote:
 If anyone wants to talk shop
 about CPUs in FPGA, like how to add Cache, MMU, and SDRAM to a 32-bit
 Gray-esque processor, let's find a better list.

 I'm not sure about as far as a MMU linux running processor in FPGA,
 I think of buying that in hardware,
 but how hard is it to take a ethernet MAC and program it to hook up to a
 low power C8051 from silabs and put the fpga machine in a Actel
 smallest igloo fpga?

The small CPU jobs are certainly practical in small FPGAs, Jan's and
many others.  Opencores is riddled with them.  But for the motherboard
concept that started this discussion, I think people would be interested
in something beefier.

   - Larry


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Re: gEDA-user: random project idea

2008-03-27 Thread Igor2
On Thu, 27 Mar 2008, Larry Doolittle wrote:

On Thu, Mar 27, 2008 at 09:28:23PM -0500, John Griessen wrote:
 Larry Doolittle wrote:
   Self-reconfigurable FPGAs have been promised for years, but aren't
   ready, and probably never will be.
 I guess that's because the fpga makers seem to not want to let out their
 programming details -- probably because they let Mentor and Synplicity
 and the like do all their tools and THEY don't want it let out.

Tools are certainly part of the story.  But it also strikes me as
a chicken-and-egg problem.  The user's don't demand or exercise the
tools because of the conceptual problems and the silicon limitations.


If we are at tools, I wonder... Is there an FPGA family that I could use
without using non-free software at all?



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Re: gEDA-user: random project idea

2008-03-27 Thread Jesse Gordon


Igor2 wrote:

 If we are at tools, I wonder... Is there an FPGA family that I could use
 without using non-free software at all?

   
I was going to ask that very question. The closest I've come to free 
was xilinx's ISE Impact webpack which of course is only free to use and 
only free for non-comercial projects. I was wondering if xilinx would 
ever release the information to allow people to make a completely open 
source truely free synthesis tool.
-Jesse



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Re: gEDA-user: random project idea

2008-03-27 Thread Larry Doolittle
Jesse -

On Thu, Mar 27, 2008 at 08:28:29PM -0700, Jesse Gordon wrote:
 Igor2 wrote:
  If we are at tools, I wonder... Is there an FPGA family that I could use
  without using non-free software at all?

 I was going to ask that very question. The closest I've come to free 
 was xilinx's ISE Impact webpack which of course is only free to use and 
 only free for non-comercial projects. I was wondering if xilinx would 
 ever release the information to allow people to make a completely open 
 source truely free synthesis tool.

Of course, synthesis is the easy part, Icarus (almost, sort of)
does that already.  Place and Route is hard, especially because
so little experience exists in the open source community.
The real sticking point is bitstream generation, where Xilinx
and Altera are traditionally anal.

This question has a long history.  Perhaps the most notable
discussion is the 173-long thread titled FPGA openness in
2000 in comp.arch.fpga.  I don't think anything important has
changed since then regarding Xilinx or Altera.

On the free front, we have the excellent research of Adam Megacz
  http://research.cs.berkeley.edu/project/slipway/
Too bad the targeted device is so pathetic.

Also as a curiosity, see Reinoud's MPGA, an open source meta-FPGA.
That one seems to have dropped off the 'net.  Does anyone have an
archived copy?

- Larry


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