In message
blupr02mb11605ab82bb0e4da6f4c426c1...@blupr02mb116.namprd02.prod.outlook
.com, dated Wed, 11 Mar 2015, Brian Oconnell oconne...@tamuracorp.com
writes:
Would be very interested in other's experience with crimped connector
failures.
Manual crimping tool used upside down.
--
OOO -
Don't believe the cost differential is significant - but cost control is only
an ancillary activity and only in the general sense. But I've never had a
failure except for vibration induced and even then it was generally the copper
but the wire still kept from flopping around. QA practices when
Thought about this and realized that I have never seen crimped connector fail
where the connector components have test certificate, and where the crimping
tool is subject to recurring calibration, and where the correct wiring
materials implemented. And have never used crimping tools or
I agree with Gary, but the quality depends on wire type and match
between wire and crimp.
Also the tool quality (if the right tool is used at all) is essential.
Crimps are suitable for stranded wire only, and the wire need to be
inserted far enough.
Crimps are subject to a number of failure
Dear all,
I am curious to know if UNECE Regulation 10 has replaced the Automotive EMC
Directive (2004/104/EC).
Can someone sheld some light in this direction?
sincerely
Tim Foo aka Foo W J
Senior Lecturer School of Engineering, ECE/BME Center
Ngee Ann Polytechnic,
535 Clementi Road,
Singapore
On Wed, 11 Mar 2015 18:48:15 +0800,
Wan Juang Foo f...@np.edu.sg wrote:
I am curious to know if UNECE Regulation 10 has replaced the Automotive EMC
Directive (2004/104/EC).
Can someone sheld some light in this direction?
In the past, under Directive 2007/46/EC, we could use either of
USB 2.0 sticks ... pluggable to PC.
Do we talk about EN55022 and EN55024 for CE marking?
#Amund
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In IEC 60079-15 Table 10 - Minimum creepage distances, clearances and
separations, Encapsulated or solid insulation is allowed to reduce the minimum
clearance requirements. Note 4 of the table states completely encapsulated in
compound to a minimum depth of 0.4 mm. What tests are required to
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