Hi
1mm is pretty thin for a heat sink made of steel. You might consider an
aluminum plate around 4 mm thick and the length and width of the case to act
as a heat spreader.
The LPRO probably already has the tape on the bottom of it. The tape may be
in fine shape. If it's not, scrape off what remains and use a normal thermal
grease (heat sink compound) between the bottom of the LPRO and the heat
spreader. You also should fill the gap between the heat spreader and the
steel case with something. I would use some sort of thermaly conductive
epoxy. You don't need the silver loaded stuff. Ceramic loaded should be ok.
Bob
On Feb 27, 2010, at 5:30 PM, Paul Boven wrote:
Dear time-nuts,
I've just bought a used LPRO-101 which should get a permanent home inside
an instrument rack. I've also found a very nice 1U high metal case, and a
fitting 24V 1U power supply - leaving plenty of room for a distribution amp
and a microcontroller to log things like lamp and Xtal voltage.
The rackmount enclosure is 1U high, and seems to be made of 1mm thick
galvanized steel. Would that make a good enough baseplate for the LPRO?
Would I need to do anything to improve the thermal contact between the
rubidium oscillator and the baseplate, and if so, any recommendations on
what to use there? The LPRO "User's guide and integration guidelines"
recommend 2degC/W thermal resistance (for up to 50degC ambient), and using
some special thermal tape that will probably be very hard to get at these
days. If any of you has already put something like this together, I'd be
very interested in your suggestions.
Regards, Paul Boven - PE1NUT
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