Well,

my guess for poly-sulfone for the top cap was not that bad:

The HP LTZ circuit, and also the LM399, were heated to about 95°C, and therefore, you need a thermally insulating plastic, which can withstand that temperature.

Poly sulfone is able to do so, whereas poly-styrene is OK for 70°C maximum, like in 45°C designs.

It would be OK also for that amateur purpose, if it's thick enough: The inner layer would deteriorate over time, but the outer side would still isolate enough.

If the whole PCB is placed inside a shielding box, the solder side cap can be omitted, of course. I would place a thin sheet of poly styrene underneath the PCB to thermally insulate the circuit.

Frank
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