someone have cited this dcument from us army corp of engineer http://www.dtic.mil/cgi-bin/GetTRDoc?AD=ada432046
it talsk about the experiments with Rossi'es TE devices. it is interesting because they don't talk about total fraud, but what look like optimism and amateurism... LTI was incorporated as a response to the thermoelectric power generation > research > by Dr. Andre Rossi. Dr. Rossi indicated that his devices would produce 20 > percent efficiencies, a vast increase from the current science of 4 > percent conversion > of waste heat to electrical power. Dr. Rossi believed that he could > increase > the physical size of the TE Devices and maintain superior power > generation. In > furtherance of his research, in early 2000, LTI had tests conducted at the > University > of New Hampshire (UNH), Durham, NH, using a small scale LTI TE Device. > Over a period of 7 days, the UNH power plant staff recorded voltage and > amperage readings every 1/2 hr. *The TE Device produced approximately 100 > volts and 1 ampere of current, providing 100 watts of power. * After this initial success, and a fire that destroyed his Manchester, NH > location, Dr. Rossi returned > to Italy to continue the manufacture of the TE Devices. In Italy, Dr. Rossi > believed that LTI could manufacture more cost-effective TE generating > devices > with lower labor and assembly costs. Accordingly, Dr. Rossi engaged a > subcontractor > to fulfill the requirements of manufacturing and assembly. > Unfortunately, the Italian subcontractor was unable to provide > secondgeneration > TE Devices with satisfactory power generation. Nineteen of 27 TE > *Devices shipped to CTC, Johnstown, PA, were incapable of generating > electricity > for a variety of reasons, from mechanical failure to poor workmanship.*The > remaining > eight produced less than 1 watt of power each, significantly less than > the expected 800–1000 watts each. Appendix C documents TE Device testing. > In an effort to determine, and possibly correct the reasons for TE Device > failures, > LTI personnel traveled to the Italian laboratory. *The common theme that > began > to emerge was the inability to upgrade from small-scale TE modules to > largescale > multiple module TE Devices with large footprints*.* The most fundamental > reason for the LTI second-generation TE Devices’ failure was the complex > thermal > expansion interplay among the various components*. Contributing to the TE > Device failure *were the large number of soldered electrical connections > (over 80)*, > *the inability to match the thermal expansion rates of the mono-block > cooling > tanks* to the circuit boards and to the semiconductor materials, all > within the > clamp pressure or the retaining hardware in the grip of high temperature > adhesives. > After a month of research and observation at the Italian laboratory, it > was determined > that the best way to proceed would be to develop an independent laboratory > in New Hampshire so that two development facilities could work at the > problems from two separate locations and viewpoints. During this period of > time, the Italian laboratory continued to deliver TE materials, but none > that exceed > the current science of TE power generation. some lessons learn are interesting to undestand today's situation > • Many TE Devices were damaged during overseas shipping because they were > transported using only light cardboard boxes with minimal bubble wrap > protection. > The LTI subcontractors were immediately notified of this problem, > and this issue will be addressed in the future. > • “Overnight” deliveries to Italy typically require a week or more to > reach their > destination due to customs. > • Communication to the Italian subcontractor was difficult at best. E-mail > communications were slow and language misunderstandings caused delays > throughout the initial project efforts while troubleshooting the > malfunctioning > of the TE Devices. All possible efforts should be made to work with > companies > familiar with engineering and business practices of the United States. > • Testing TE Devices and wafer materials is a science of its own. Measuring > the internal resistance of a TE Device or a single wafer pair proved > challenging. > (The multimeter applied a current through the TE materials, inducing > the Peltier effect, which caused errors in measurements.) > (by the way if some one can explain, shortly and honestly what happens with AG... look like bipolar crisis. about Rossi, he does not seems more strange that usual and the only serious concern about what he have said or lied, is about the 12 big-ecat that seems to be irrational, except if they are from various clients, or just an option if all is ok and it works like a breeze... all the rest, like DGT silence, or politician lying, is expected )
