Hi All, I'm currently modifying RevC / PCB Rev B6 for integration into a custom design. I have a few questions if others could provide input. The design is imported into Altium, and I feel there may be some missed PCB settings during the import.
*1. Layer Stackup + Copper thickness* - Are there any details on the layer stackup + copper used? I would imagine this could impact some of he high speed / memory interfaces etc.. *2. Minimum track width *- The following nets have 3.75mil tracks vs most other nets with 4.75mil thickness. HDMI_Tx(x) lines. DDR_DQS(n)(x) lines DDR_CLK lines Is there any issues using these thicknesses with standard 4/4 PCM Manufacturing processes. Or does this require specialised manufacturing. Would making these lines 4+mil have much effect on signal integrity ? *3. Wedge shaped pad connects* - On some tracks, the pad connections have a wedge shape meeting the track as shown below. I haven't seen this before, what is the reason for this ? <https://lh3.googleusercontent.com/-VCacqeV7XRw/Vp2zSPx38VI/AAAAAAAAIgA/9-4dP5Trf5s/s1600/via_wedge_connection.jpg> *4. Any other advice ?* Has anyone done this before ? Are there any traps or other gotchas I Need to be looking out for ? Thanks in advance for your help. Rob. -- For more options, visit http://beagleboard.org/discuss --- You received this message because you are subscribed to the Google Groups "BeagleBoard" group. To unsubscribe from this group and stop receiving emails from it, send an email to beagleboard+unsubscr...@googlegroups.com. For more options, visit https://groups.google.com/d/optout.
