On Sep 11, 2011, at 9:38 PM, John Parker wrote: > Monty, ditch the Scotch tape. It can generate large amounts of ESD when > pulled > off the spool or during removal. I have worked with parts for space > instruments > and have had the NASA ESD training a couple of times as well as some other > ESD > training. I like Scotch products but the tape and modern electronics do not > mix. > Glad to see you are doing surface mount though. I have not tackled this at > home > yet. > > I would send this out to the reflector but I am using a browser based E-mail > that there is some trick to posting. Feel free to pass this on. > > 73, John WB4UHC > K3 #2165 > > > ----- Original Message ---- > From: Monty Shultes <mon...@mindspring.com> > To: d...@w3fpr.com > > Don, you old f**t, I'm 32 already, 10 months older than thee. > > Regarding surface mounts, I have used Scotch tape to pick up and place parts. > > It holds nicely while tack soldering and is easy to reposition. I also like > to > "flood with solder and wick the excess", it's risky, but usually works fine. > I > built the daughter card for PIC-L III, which has a 24-pin SMT IC, this way. > > Flux is important, as several have noted. It can hold the part temporarily, > too. > > Monty K2DLJ > > On Sep 10, 2011, at 12:32 AM, Don Wilhelm wrote: > >> Actually, I will celebrate my 32nd birthday next February. Since "Life >> begins at 40", I decided to start counting from there. :-) >> >> 73, >> Don W3FPR
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