Bob, I have been successful using that technique, but when there is any difficulty with the solder re-attaching, I slide a THIN knife blade under the first side when the solder melts. The blade must be thin (and must have a sharp edge) so the amount of lift is very small - a thick blade could pull the pad that is still soldered to the board.
73, Don W3FPR Bob Naumann wrote: > I find that the key to removing SMT components like those involved in the > mods described is best done with solder-wick and quick movement of one > small-tipped iron to both ends of the component. I removed most of the > solder with the solder-wick and then alternate heating of both ends of the > component until it lifts up from one end. It then becomes a matter of > heating the remaining end and plucking the old part off with the iron's tip. > Then, clean the pads with the solder wick and install the new component. > > Being able to see is crucial, and loads of task lighting is helpful. > > 73, > > Bob W5OV > > ______________________________________________________________ Elecraft mailing list Home: http://mailman.qth.net/mailman/listinfo/elecraft Help: http://mailman.qth.net/mmfaq.htm Post: mailto:Elecraft@mailman.qth.net This list hosted by: http://www.qsl.net Please help support this email list: http://www.qsl.net/donate.html
