Your philosophy is mine but for one thing:

It's not because a product cannot meet requirements as put on the market
that it should be excluded ..


It could for example be sold in an enclosure, so as to meet ESD requirements.
It's not a absolute requirement for these board to be sold
as a bare PCB. It has consequences for the prices of course but
that is valid for each device, not for development boards only.

And it is not because you can touch a chip, that it need to be
tested. Standards speak about likely to be touched in normal use.
Connector internal pins on my Ipad are accessible too, but most standards do
not include them for ESD testing. It may be wise to do so, but that is another 
story.


BTW did anyone obtain a satisfactorily answer from Farnell or any other seller ?

Your opinion about the EC in these, in casu their authors, is not mine.
EC texts do generally excel in quality, what need not be the same as
clear to us,  or in line with our needs. Note that they are
addressed to the member states and their legal advisors and not to
the end users. If unclear on a special subject, than it 
certainly is the case because the subject is not well enough defined, or
it would open a way to avoid requirements by what i call
smart naming or smart selling.

 


Regards,

Ing.  Gert Gremmen, BSc



g.grem...@cetest.nl
www.cetest.nl

Kiotoweg 363
3047 BG Rotterdam
T 31(0)104152426
F 31(0)104154953

 Before printing, think about the environment. 



-----Oorspronkelijk bericht-----
Van: Piotr Galka [mailto:piotr.ga...@micromade.pl] 
Verzonden: Monday, November 04, 2013 6:23 PM
Aan: EMC-PSTC; ce-test, qualified testing bv - Gert Gremmen
Onderwerp: Re: [PSES] EMC requirements for developer/evaluation boards

Hi Gert,

> To Piotr: ESD test are normally carried out on enclosure and connector 
> shielding, not to internal circuits.
> HCP and VCP discharge are designed for this.
>

My logic is:
The idea of ESD test is to check possible events which can happen in normal use 
of device.
The possible source of ESD are human fingers.
Human fingers touches enclosure and not internal circuits because enclosure is 
between fingers and internal circuits.
So ESD is tested on enclosure and on HCP and VCP = all expected ESD that can 
happen to and near device.
If device has plastic enclosure than in real ESD to something near device has 
higher probability than to device (which is close to 0%).

If there is no enclosure than human fingers can touch directly internal 
circuits so following the idea of testing all possible ESD events in my opinion 
ESD should be also tested to internal circuits. I think that for such device 
the ESD to internal circuits has much higher probability than to something near 
(HCP and VCP). There is no idea to testing something less probable and not 
testing something more probable.

If the prototype board is to be used only in ESD protected environment than 
testing ESD to internal circuits can have no sense but testing ESD to HCP and 
VCP also has no sense.

But generally I think that prototype board should be excluded from EMC at all 
and it should be written in the first EMC directive version long time ago.
When I first time read EMC (in 2002 - two years before we (Poland) joined
EU) the question about prototype board was my first thought.
Being not clear solved in directive that subject makes me to have clear opinion 
about its authors.

Best Regards
Piotr Galka

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