Hi Ken

 

No, I have not considered edge-plating. I’ll look into this now.

We have some high frequency noise (400-500MHz) from differential lines leaking 
out from an inner layer of a multilayer pcb. Edge-plating might be a good 
solution.

Thanks for the tip.

 

BR
Amund

 

Fra: IBM Ken 
Sendt: 18. februar 2020 23:18
Til: EMC-PSTC@LISTSERV.IEEE.ORG
Emne: Re: [PSES] Ground copper fill on signal layer on multilayer PCB

 

Hi Amund!  Have you also considered edge-plating?  Are you trying to reduce 
radiated noise outside your product, or cross-talk within the product (or both)?

 

On Tue, Feb 18, 2020 at 3:03 AM Amund Westin <am...@westin-emission.no 
<mailto:am...@westin-emission.no> > wrote:

Between two solid ground planes, we have a signal layer, routing high speed 
differential lines.

 

What do you recommend: 

I.      fill the remaining area with copper in the signal layer 
II.     fill only the border of the layer (5mm ground copper trace around the 
layer edge)
III.    no fill at all

 

 

Best regards

Amund

 

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