Hi Amund,
Since your potential problem appears to be at relatively low
frequencies, an alternative to edge plating would be stitching the
ground planes along the board edges with closely spaced vias. We have
done this at SUN Microsystems also as a preventive measure. On the other
hand, you should also consider the possibility that the leaking happens
not through the edge of the board but through components connected to
internal traces but sitting on the top or bottom of the board. What I
am saying is that it is not necessarily the edge of the board that
radiates. You could check this by poking around with a close-field
probe, even uncalibrated unshielded home-made small loop or monopole
antennas might give you a useful hint where the noise is coming from.
You could also put absorbing sheets to the edge of the board to see if
it makes a difference in the overall radiation.
Best regards,
Istvan Novak
Samtec
On 2/19/2020 1:50 AM, Amund Westin wrote:
Hi Ken
No, I have not considered edge-plating. I’ll look into this now.
We have some high frequency noise (400-500MHz) from differential lines
leaking out from an inner layer of a multilayer pcb. Edge-plating
might be a good solution.
Thanks for the tip.
BR
Amund
*Fra:* IBM Ken
*Sendt:* 18. februar 2020 23:18
*Til:* EMC-PSTC@LISTSERV.IEEE.ORG
*Emne:* Re: [PSES] Ground copper fill on signal layer on multilayer PCB
Hi Amund! Have you also considered edge-plating? Are you trying to
reduce radiated noise outside your product, or cross-talk within the
product (or both)?
On Tue, Feb 18, 2020 at 3:03 AM Amund Westin <am...@westin-emission.no
<mailto:am...@westin-emission.no>> wrote:
Between two solid ground planes, we have a signal layer, routing
high speed differential lines.
What do you recommend:
1. fill the remaining area with copper in the signal layer
2. fill only the border of the layer (5mm ground copper trace
around the layer edge)
3. no fill at all
Best regards
Amund
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