On 21 July 2010 17:34, Gene Heskett <[email protected]> wrote: > I thought of that Mark, but most of that stuff takes 425+F to soften it for > later dis-assembly. Can the rest of the stuff tolerate about 475F for long > enough to take it apart, Andy?
I am not sure how the O-rings would cope (probably OK) The part does not have to seal air (in fact, that would be counterproductive). It is the lower "pull" plate for my drawbar release. http://imagebin.ca/view/yPr__7Mi.html -- atp ------------------------------------------------------------------------------ This SF.net email is sponsored by Sprint What will you do first with EVO, the first 4G phone? Visit sprint.com/first -- http://p.sf.net/sfu/sprint-com-first _______________________________________________ Emc-users mailing list [email protected] https://lists.sourceforge.net/lists/listinfo/emc-users
