Hey ALL,
Blind-vias and Buried-vias.
I have had some experience with both of these scenarios.
I did an 8-layer mixed signal (analog/digital) instrumentation board that was
very limited on space.
A problem I had was I needed blind vias that were between 2-different layers
that were not adjacent to each other, so here is what I did. I stacked blind
vias on top of each other, and that seemed to work out OK and the board house
had no problem with this. Make sure that your drill file reflects this type of
method. I jumped between 5-layers using this method, and everything seemed to
work fine. I did use P98SP3 for autorouting, and get me in the ball park, then I
cleaned up the little things until it DRC'd clean.
So, I can't tell you any more about "nasties", but it is do-able!!
Keith
--
*************************************
Keith Ashcraft
ITT Industries
Advanced Engineering & Sciences
5009 Centennial Blvd.
Colorado Springs, CO
80919
(719) 599-1787
[EMAIL PROTECTED]
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