Ok, after an astoundingly short (five minute) search, I found the solution to the polygon problem: whoops. RTFM, I suppose.
However, my other two questions still stand:
Also, this is a two layer board: the top layer traces are in the component
layer, and the bottom layer traces are in the >solder layer. Should I place the ground plane in the solder layer as well? Or should I put it in the GND layer to >differentiate it from the traces on the bottom of the board?
And one last thing: Some of the vias have rectangular copper bits around
them, presumably to catch more solder and >create a little heat sink (just a guess: I really don't know). So far, I've just been placing vias and drawing the rectangular >copper sections by hand: is there a better way?
Thanks much, Jeremy <http://www.seul.org/cgi-bin/mailman/listinfo/geda-user>
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