On Mon, Mar 10, 2008 at 5:16 PM, Dave N6NZ <[EMAIL PROTECTED]> wrote:
> > DJ Delorie wrote: > >> PCB needs first class support for oblong through-holes. > > > > Yup. I've talked about a "multi-pin" before; this is a pin with > > arbitrary shaped copper/soldermask/etc on each layer. > > > Yes, when you get to multi layer boards you often want a different > annulus on inner layers. > > I think it's time to think about an expansion to the footprint grammar > to support more sophisticated pins and also more sophisticated paste > specs. > > -dave > > Without piling on too much.... - Expanding the grammar to support inner layer pad <> outer layer pad would be great. (Would one geometry definition apply to all inner layers?) - Also consider whatever would allow pins (and vias) with no connection to some layers (maybe supporting blind and buried vias in the process?) - Taking this too the limit, consider a shift to a more heirarchical approach which would allow pad definitions to be "included" in a footprint by reference rather than direct inclusion. (My ignorance of the data structures now used by PCB may be evident here - I don't know how difficult this would be). Joe T
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