I haven't tried this but a work around might be to use a polygon rather then a pad. If you need to solder to the polygon then make a small pad not connected to the via and open the soldermask clearence but not the polygon clearance.
Steve M joe tarantino wrote: > > > On Mon, Mar 10, 2008 at 5:16 PM, Dave N6NZ <[EMAIL PROTECTED] > <mailto:[EMAIL PROTECTED]>> wrote: > > > DJ Delorie wrote: > >> PCB needs first class support for oblong through-holes. > > > > Yup. I've talked about a "multi-pin" before; this is a pin with > > arbitrary shaped copper/soldermask/etc on each layer. > > > Yes, when you get to multi layer boards you often want a different > annulus on inner layers. > > I think it's time to think about an expansion to the footprint grammar > to support more sophisticated pins and also more sophisticated > paste specs. > > -dave > > Without piling on too much.... > > - Expanding the grammar to support inner layer pad <> outer layer pad > would be great. (Would one geometry definition apply to all inner > layers?) > - Also consider whatever would allow pins (and vias) with no > connection to some layers (maybe supporting blind and buried vias in > the process?) > - Taking this too the limit, consider a shift to a more heirarchical > approach which would allow pad definitions to be "included" in a > footprint by reference rather than direct inclusion. > (My ignorance of the data structures now used by PCB may be evident > here - I don't know how difficult this would be). > > Joe T > ------------------------------------------------------------------------ > > > > _______________________________________________ > geda-user mailing list > geda-user@moria.seul.org > http://www.seul.org/cgi-bin/mailman/listinfo/geda-user > _______________________________________________ geda-user mailing list geda-user@moria.seul.org http://www.seul.org/cgi-bin/mailman/listinfo/geda-user