On Thu, Apr 2, 2009 at 6:59 PM, Ethan Swint <eswint.r...@verizon.net> wrote: > Steve Underwood wrote: >> away the surplus solder in seconds. Creating a huge continuous blob of >> solder around the four side is the strategy for removing a QFP. >> > The way I like to remove QFPs (assuming that they're dead) is with a bit > of bare AWG30 behind the pins. Run the wire between pins and package, > anchor one end through a via, pull on the free end and the chip will > 'unzip' as you move down the edge with a big iron.
I have been using the 20mil wide 30deg bent tip to desolder the QFPs. I hook the tip around the back of the lead, let it heat a little and pull. After three sides are done I press down on the center of the body with my tweezers as I desolder the fourth side. (* jcl *) -- You can't create open hardware with closed EDA tools. http://www.luciani.org _______________________________________________ geda-user mailing list geda-user@moria.seul.org http://www.seul.org/cgi-bin/mailman/listinfo/geda-user