DJ Delorie wrote: >> I would think that mounting the chip upside down would allow >> better heat distribution?? I could be wrong. You may need a heat >> sink? >> > > The whole point of the bottom pad is to get heat out of the chip; > there are expectations like having copper and vias under the pad to > get the heat to the opposite side of the pcb where it can be > dissipated. > > If you flip the chip over, the heat can only be dissipated by the air > contact with the pad itself. It would probably work for a while, but > may not be reliable that way. The data sheets often tell you how many > square inches of copper on the other side are needed for various > situations. I suppose you could hand-solder some copper foil or > desolder braid to the pad, as long as you're careful to not short the > pins. >
All great ideas, everyone. Thanks! But I think the big-picture lesson here is to "go get a toaster oven". :) b.g. -- Bill Gatliff b...@billgatliff.com _______________________________________________ geda-user mailing list geda-user@moria.seul.org http://www.seul.org/cgi-bin/mailman/listinfo/geda-user