DJ Delorie wrote: >> I would think that mounting the chip upside down would allow >> better heat distribution?? I could be wrong. You may need a heat >> sink? > > The whole point of the bottom pad is to get heat out of the chip; > there are expectations like having copper and vias under the pad to > get the heat to the opposite side of the pcb where it can be > dissipated.
as one who has put die in exposed paddle QFN's... the heat dissipation is a big deal but so is the electrical grounding with as low inductance as possible. -Dan _______________________________________________ geda-user mailing list geda-user@moria.seul.org http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
