On Wed, 2009-04-29 at 11:11 +0200, Gabriel Paubert wrote: > With a BGA, it will be hundreds of > points pulling themselves into alignment. But I don't see how you > are going to put the solder paste without a stencil. > > Gabriel
I think BGA devices, if soldered for the first time, need only flux, no solder paste. The pins already have some tin on it. _______________________________________________ geda-user mailing list geda-user@moria.seul.org http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
