Due to these problems BGAs are the only parts that
will remain leaded even on a PB-free board. 

Mira

--- Dennis Saputelli
<[EMAIL PROTECTED]> wrote:

> that is a good point
> in fact i have been wondering about how to clean
> under these things, it 
> has been my understanding that for BGAs the
> preferred process is 
> no-clean because water is 'too big' and solvent is a
> no-no
> again, how does all this relate to lead-free ?
> i think LF needs a more aggressive flux, correct ?
> 
> ds
> 
>
_______________________________________________________________________
> Integrated Controls, Inc.           Tel:
> 415-647-0480  EXT 107
> 2851 21st Street                    Fax:
> 415-647-3003
> San Francisco, CA 94110            
> www.integratedcontrolsinc.com
> 
> 
> Brad Velander wrote:
> > Dennis,
> >     Actually there was a little bit of both via in
> pad and dog bone involved. Throw into the mix that
> we have a fabricator telling us that we must stop
> tenting our vias because it is resulting in board
> contamination post cleaning (the cleaning water
> contaminating the boards when it is not completely
> removed from the blocked via holes) and you can see
> the problem coming at you like a freight train.
> > 
> >     The via size issue came to me from one of our
> engineers, I haven't seen the articles myself, that
> would be the next step, see if I can actually see
> the articles and quantify the precise case and
> conditions they are discussing.
> > 
> > Sincerely,
> > Brad Velander
> > Senior PCB Designer
> > Northern Airborne Technology
> > #14 - 1925 Kirschner Road,
> > Kelowna, BC, V1Y 4N7.
> > tel (250) 763-2329 ext. 225
> > fax (250) 762-3374
> > 
> > 
> > 
> > -----Original Message-----
> > From: Dennis Saputelli
> [mailto:[EMAIL PROTECTED]
> > Sent: Thursday, December 08, 2005 8:47 AM
> > To: Protel EDA Discussion List
> > Subject: Re: [PEDA] Via Solder Thieving, heard of
> this?
> > 
> > 
> > 
> > Hi Emanuel,
> > 
> > i think what you are writing about here is a
> different issue than we 
> > were discussing
> > 
> > i believe the discussion was about having the via
> inside the BGA pad 
> > itself, not the 'dogbone' via typically used to
> fan out the BGA pad
> > this is often called 'via in pad'
> > 
> > if the via inside the BGA pad is small enough the
> solder paste will not 
> > flow through it
> > 
> > the topic is at what size this is good practice
> > 
> > i would call what you describe here more something
> like 'bridging' than 
> > 'theiving'
> > 
> > i would yell at your fabricator
> > these days there is no room for sloppy solder mask
> registration
> > 
> > Dennis Saputelli
> > 
> >  
> >
>
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