Mira wrote:
Due to these problems BGAs are the only parts that
will remain leaded even on a PB-free board.
Can you do this and still comply with RoHS? The last thing
I heard was that the .1% Pb content limit was PER COMPONENT,
not per entire assembly, as I had thought before. Just taking a wild
guess, I can't see how 37/63 Pb-Sn solder balls could stay under .1%
lead content on a lot of BGA parts. The rest of the BGA really doesn't
weigh very much.
Jon
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