Brad Velander wrote:
Jon,
I believe that the key to the 0.1% limitation is the fact that it must
be a homogeneous part. i.e. one part that cannot be reduced to lesser
sub-materials. A solderball on a BGA is not a homogeneous part. Basically I
believe that no electrical component is a homogeneous part. I believe that a
straight steel screw containing 0.1% lead content is a homogeneous part, a
screw plated with something that contains 0.1% lead is not a homogeneous part
because the plating can be removed and therefore is not homogeneous. Same would
stand for a BGA. Unless there is something which has come along recently to
change this since I last was looking at the issue(s).
At least this is what I have come to understand about the 0.1% limitation.
Otherwise there would be a lot of assemblies that could pass the 0.1% lead rule with no
special lead-free concerns because the lead would not make up 0.1% of the total weight.
The key word of concern is the word "homogeneous".
OK, so I think you are agreeing with me that the BGA parts with
Pb-containing
solder balls would not be RoHS compliant. Do I have that right?
The way you describe it, then, the entire BGA component must have absolutely
ZERO lead in it to be compliant. Only if the part is entirely homogeneous
can there be any lead at all in it.
I'm still totally astounded that we are fretting over milligrams of lead in
electronic devices while car batteries have tens of KILOGRAMS of lead in
them. My guess is that the amount of lead scattered about in car accidents
is WAY more than the lead leaching out of some circuit boards.
Jon
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